WMSIC Electronic Components

MICROCHIP 24LC64FT-I/OT 24LC64FT

Model24LC64FT-I/OT
PackageSOT-23-5
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP 24LC64FT-I / OT
Type
MICROCHIP
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
24LC64FT-I/OT
Electronic Component
1
Package
SOT-23-5
Electronic Component
EEPROM
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0231132671
Electronic Component
64Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
400kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

24LC64FT-I/OT 产品概述

一、产品简介

24LC64FT-I/OT 是美国微芯(MICROCHIP)生产的一款工业级 I2C 串行 EEPROM,存储容量为 64Kbit(8192 字节),工作温度范围 -40℃ 至 +85℃,工作电压 2.5V~5.5V,封装为 SOT-23-5,适合对体积、功耗与可靠性有较高要求的分布式存储与配置保存场景。该器件兼容标准 I2C 总线协议,支持高达 400kHz 的时钟频率,便于与 MCU、FPGA 等主控器件快速通信。

二、主要参数

  • 容量:64Kbit(8K 字节)
  • 接口:I2C(标准 7 位寻址,最高 400kHz)
  • 工作电压:2.5V~5.5V
  • 工作温度:-40℃~+85℃
  • 写周期时间(Tw):典型 5ms(字节/页写入完成时间)
  • 写周期寿命:1,000,000 次
  • 数据保持时间 TDR:200 年(典型条件下)
  • 封装:SOT-23-5(小外形,利于空间受限设计)

三、关键特性

  • 小尺寸封装(SOT-23-5),便于 PCB 布局与空间受限产品应用;
  • 支持页面写入(page write),单次写入最多 32 字节,提高写入效率;
  • 宽电压范围 2.5V~5.5V,可与 3.3V/5V 系统直接兼容;
  • 高可靠性:百万次写入寿命与极长的数据保持能力,适合长期配置或校准数据保存;
  • 兼容 I2C 标准,便于在现有 I2C 总线上与其它器件共存。

四、典型应用

  • 工业控制器与传感器节点的参数/校准数据保存;
  • 消费电子的配置与序列号存储;
  • 通讯设备中的固件或用户配置备份;
  • 物联网终端、低功耗模块的非易失性存储。

五、设计与使用建议

  • 总线设计:SDA、SCL 需外接上拉电阻(参考值 4.7kΩ 在 3.3V 系统,10kΩ 在 5V 系统);器件支持最高 400kHz,布线尽量短且加屏蔽以降低干扰。
  • 电源与去耦:VCC 端建议并联 0.1μF 贴片电容靠近器件引脚,确保电源稳定。
  • 写入管理:采用页面写入以提高效率,写周期完成前可使用 ACK polling(轮询设备应答)或等待 Tw(约 5ms)确认写入完成,避免在写入期间发起新操作。
  • 保护与可靠性:在需要固化关键数据时,使用器件的写保护机制(如封装带 WP 引脚)或在系统级实现软件写保护策略;注意遵循写周期寿命限制并考虑磨损均衡策略以延长使用寿命。
  • 电压与温度限制:确保系统电压和工作环境在器件规定范围内,超范围工作会影响数据保持与可靠性。

六、封装与可靠性说明

SOT-23-5 小封装适合空间受限设计并可实现自动贴装与波峰/回流焊工艺。器件在工业温度等级和百万次写耐久、200 年数据保持的组合使其在长期可靠性要求高的应用中表现优异。建议在关键系统中参考器件完整数据手册以获取引脚定义、时序图及电气特性详细参数。

如需更详细的引脚定义、时序、典型应用电路及 PCB 布局建议,可参考 Microchip 官方数据手册或提供您的具体应用场景,我可给出更针对性的设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.