WMSIC Electronic Components

MICROCHIP TC4428AEOA713

ModelTC4428AEOA713
PackageSOIC-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP TC4428AEOA713
Type
MICROCHIP
Minimum package
3300 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
TC4428AEOA713
Electronic Component
1
Package
SOIC-8
Electronic Component
Gate Driver IC
Electronic Component
0.176g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0227182332
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~18V
Load Type
MOSFET
Current(IOH)
1.5A
Current(IOL)
1.5A
Driver Channel Count
2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC4428AEOA713 产品概述

一、简介

TC4428AEOA713 是 MICROCHIP(美国微芯)推出的一款双通道低端 MOSFET 栅极驱动器,封装为 8 引脚 SOIC。器件集成一路反相和一路非反相输出,适用于驱动功率 MOSFET 的栅极,实现快速切换以降低开关损耗和开关过渡时间。器件工作电压范围宽(4.5V 至 18V),兼顾低压逻辑接口与较大栅极驱动电平的要求。

二、主要电气参数(概要)

  • 负载类型:MOSFET
  • 驱动通道数:2(1 路反相 + 1 路非反相)
  • 输出电流(灌/拉):IOL = 1.5A,IOH = 1.5A(峰值短时能力,用于快速充放电栅电容)
  • 工作电压:4.5V ~ 18V(VDD)
  • 上升时间 tr:25ns(典型)
  • 下降时间 tf:25ns(典型)
  • 传播延迟 tpLH / tpHL:30ns / 30ns(典型)
  • 静态电流 Iq:100μA(待机/静态条件下)
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 封装:SOIC-8

三、功能与特性

  • 双通道设计,一路反相一路非反相,便于半桥/全桥逻辑管理与独立控制。
  • 强劲的瞬态输出电流(±1.5A 峰值)可快速驱动大容量栅电容,缩短开关时间,降低开关损耗。
  • 宽工作电压范围兼容常见门极驱动电压(5V、10V、12V、15V 等)。
  • 低静态电流,适合需节能或空闲功耗受限的系统。
  • SOIC-8 小封装,便于低成本 PCB 布局与自动化贴装。

四、典型应用场景

  • 开关电源(SMPS)中 MOSFET 驱动(同步整流、主开关)
  • 电机驱动(半桥/全桥驱动)
  • DC-DC 转换模块
  • Class D 音频放大器的功率级
  • 任何需快速切换功率 MOSFET 的场合

五、设计与布局建议

  • 电源去耦:VDD 旁近端放置 0.1μF 陶瓷去耦电容,同时并联 1μF~10μF 滤波电容以抑制低频纹波;去耦电容应尽量靠近器件 VDD 与 GND 引脚焊盘。
  • 栅极电阻:为控制开关边沿与抑制振铃,可在输出与 MOSFET Gate 之间串联小阻(例如 2.2Ω~22Ω),根据系统 EMI 与开关损耗权衡选择。
  • 接地布线:采用短而粗的地回流路径,避免将大电流环路经过敏感模拟地。
  • 热管理:虽然输出为短时大电流能力,连续高频大电流开关会提升器件发热,需评估 PCB 铜箔面积或散热手段,避免器件长期处于高温。
  • 输入逻辑兼容:输入端应满足器件输入阈值,若来自低压逻辑(如 3.3V),需确认在 VDD 选择下逻辑有效性或加驱动/电平移位电路。

六、封装与订购信息

  • 封装:SOIC-8(工业常用封装,便于自动化贴装与焊接)
  • 工作温度(Ta):-40℃ ~ +85℃
  • 品牌:MICROCHIP(美国微芯)
  • 型号示例:TC4428AEOA713(请参考 MICROCHIP 官方数据手册获取引脚排列、绝对最大值、典型曲线及完整规范)

备注:本文档基于基础参数给出概要与应用建议,设计前建议认真参阅 MICROCHIP 官方数据手册及电气特性表,确认瞬态电流能力、功耗、绝对最大额定值及热阻等详细指标,以满足系统可靠性要求。

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