Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICROCHIP AT24C08D-MAHM-T AT24C08D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICROCHIP AT24C08D-MAHM-T
- Type
- MICROCHIP
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MICROCHIP
- Electronic Component
- AT24C08D-MAHM-T
- Electronic Component
- 1
- Package
- UDFN-8-EP(2x3)
- Electronic Component
- EEPROM
- Electronic Component
- 0.2g
- Electronic Component
- 1
- Features
- Built-in positions(POR)
- Electronic Component
- BM0257712393
- Electronic Component
- 8Kbit
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.7V~3.6V
- Interface Type
- I2C
- Electronic Component
- 100
- Clock Frequency(fc)
- 1MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AT24C08D-MAHM-T 产品概述
一、产品简介
AT24C08D-MAHM-T 是 Microchip（美国微芯）推出的一款低功耗 I²C 总线 EEPROM，容量 8Kbit（1K × 8）。器件支持高速度 I²C 通讯（最高 1MHz），适用于对非易失性配置数据、标识信息、校准常数等需要长期保存的小容量存储场合。封装为紧凑型 UDFN-8-EP（2×3 mm），适合空间受限的现代电子产品。
二、主要特性
- 接口类型：I²C（标准/快速/高速度模式，最高 1MHz）
- 存储容量：8Kbit（1K × 8）
- 工作电压：1.7 V ～ 3.6 V，适配多种电源域
- 写周期时间（Tw）：典型 5 ms（页写操作需等待完成）
- 典型读取延迟：4.5 µs（参考器件手册）
- 数据保留（TDR）：100 年
- 写周期寿命：1,000,000 次
- 工作温度：-40 ℃ ～ +85 ℃
- 封装：UDFN-8-EP（2×3 mm），含焊盘热沉设计
- 品牌：Microchip（美国微芯）
三、关键技术参数（便于快速查阅）
- 总线：双线 I²C（SDA、SCL）
- 最高时钟频率：1 MHz
- 电源范围：1.7 V ～ 3.6 V（支持 1.8 V 与 3.3 V 系统）
- 数据保持与耐久性：100 年数据保持，100 万次擦写寿命
- 环境：工业级温度范围 -40 ～ +85 ℃
四、典型应用场景
- 工业控制与传感器节点的参数保存、校准数据存储
- 智能家居与消费电子中的配置、设备标识信息存储
- 医疗设备与仪表的非易失量测数据保存
- 引导/固件辅助数据、序列号、MAC 地址等少量数据存储
五、设计与使用建议
- I²C 总线需外接上拉电阻，阻值根据总线速度与负载选择（常用 4.7 kΩ～10 kΩ）；高速 1 MHz 下可适当减小阻值以改善上升时间。
- 推荐在 VCC 端并联 0.1 µF 陶瓷去耦电容，靠近器件引脚布置。
- 写操作后请使用 ACK 轮询（或等待最小写周期 Tw≈5 ms）确认内部写入完成，避免在写周期内再次发起写命令导致失败。
- 如系统电压高于器件最大额定电压，需做电平转换或使用隔离方案。
- 若使用封装底部焊盘（EP），在 PCB 布局时按器件手册建议设计焊盘与热沉过孔以保证可靠焊接与热散。
- 如需硬写保护，请参考器件手册使用 WP（写保护）引脚（若封装提供）。
六、封装与采购提示
- 封装型号：UDFN-8-EP（2×3 mm），适合贴片自动化装配。
- 型号后缀 -T 通常表示卷带供货（Tape & Reel），适合 SMT 产线。
- 采购时请核对完整料号与批次，并参考 Microchip 官方数据手册获取详细引脚定义、时序图与推荐 PCB 焊盘信息。
如需更详细的时序、页写大小与引脚图，建议参照 Microchip AT24C08D 官方数据手册或提供具体应用电路图以便给出针对性的布线与抗扰建议。
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