WMSIC Electronic Components

MICROCHIP MCP9700AT-E/LT MCP9700AT

MICROCHIP MCP9700AT-E/LT MCP9700AT
1 / 3

Product image

ModelMCP9700AT-E/LT
PackageSC-70-5
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP MCP9700AT-E / LT
Type
MICROCHIP
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP9700AT-E/LT
Electronic Component
1
Package
SC-70-5
Electronic Component
Temperature Sensor
Electronic Component
±2℃
Electronic Component
0.035g
Electronic Component
1
Features
Low Power
Electronic Component
BM0000002656
Operating Voltage
2.3V~5.5V
Electronic Component
40℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP9700AT-E/LT 产品概述

一、产品背景

MCP9700AT-E/LT 是微芯科技（Microchip Technology Inc.) 旗下的一款高性能温度传感器，属于模拟本地温度传感器系列，其设计目标是满足广泛应用场景中的温度监测和控制需求。凭借其广泛的工作温度范围、优秀的精度和紧凑的SC-70-5封装，MCP9700AT-E/LT 成为各种电子设备中不可或缺的组件，尤其适用于需要精确温度检测的应用场景。

二、主要特点

  1. 温度范围：MCP9700AT-E/LT 支持的本地感应温度范围从 -40°C 到 125°C，满足极端条件下的操作需求，适合在户外、工业以及家庭环境中使用。

  2. 精度与分辨率：该传感器的精度为 ±2°C，能在多种环境条件下提供可靠的温度读数。其分辨率为10mV/°C，意味着在不同的温度变化下，传感器能够提供精细的电压输出，便于后续的数字化处理和分析。

  3. 工作环境：MCP9700AT-E/LT 能够在更宽的温度范围内稳定操作，测试条件为 0°C 到 70°C，整体工作温度覆盖 -40°C 到 125°C，为各种环境下的设计提供了灵活性。

  4. 供电电压：该传感器工作于 2.3V 到 5.5V 的电压范围，适配多个电源管理方案，便于与现有设备的兼容性。

  5. 输出特性：传感器输出类型为模拟电压，能够直接与多种类型的模拟电路兼容，简化了设计过程，省去了额外的模数转换步骤，降低了系统的复杂性。

  6. 封装方式：MCP9700AT-E/LT 采用SC-70-5封装，体积小巧，适合空间受限的应用场景，便于集成到各种紧凑型电子设备中。

三、应用领域

MCP9700AT-E/LT 在多个行业和领域都有广泛的应用，包括但不限于：

  1. 消费电子：用于家用电器、智能家居系统的温度监控，提高产品的智能水平和用户体验。

  2. 汽车电子：在汽车的引擎温度、车内环境监测中进行应用，以增强车辆的安全性和提高能效。

  3. 工业自动化：在生产设备、环境监测设备中，根据环境温度变化来调节机器和控制系统的运行。

  4. 医疗设备：用于医疗器械、环境监测装置等，确保设备在合适的温度范围内工作。

  5. 通信设备：监测设备运行状态以保证信号的稳定性和设备寿命，避免过热导致的故障。

四、总结

MCP9700AT-E/LT 温度传感器以其优良的性能、灵活的应用范围和小巧的封装设计，成为现代电子设备中不可或缺的组成部分。作为一款可靠的模拟温度传感器，它能够高效地满足各类温度监测需求，并在各行业的应用中展现出卓越的价值。无论是消费电子、工业自动化还是汽车电子系统，MCP9700AT-E/LT 都是您理想的选择，帮助您实现更智能、更高效的温度控制解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.