WMSIC Electronic Components

MICROCHIP KSZ8863RLLI-TR KSZ8863RLLI

ModelKSZ8863RLLI-TR
PackageLQFP-48(7x7)
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP KSZ8863RLLI-TR
Type
MICROCHIP
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
KSZ8863RLLI-TR
Electronic Component
1
Package
LQFP-48(7x7)
Electronic Component
Ethernet Transceiver
Electronic Component
0.33g
MACInterface
RMII
Electronic Component
1
Features
Low Power; Programmable LED
Electronic Component
BM0084327849
Operating Temperature
40℃~+85℃
Operating Voltage
3.3V
Data
10Mbit/s;100Mbit/s
Electronic Component
3
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KSZ8863RLLI-TR 产品概述

概述

KSZ8863RLLI-TR 是由美国微芯(Microchip Technology Inc.)推出的一款高性能以太网交换芯片,专为灵活的网络应用设计。它支持多种接口协议,如I²C和SPI,广泛适用于需要以太网连接的嵌入式系统中。其封装形式为LQFP-48,体积紧凑(7x7mm),适合空间受限的应用场景。

关键特性

  1. 以太网功能:

    • KSZ8863RLLI-TR 能够工作在10/100 Base-T/TX PHY标准下,保证了高效的网络数据传输。芯片能够支持多路数据传输,用户可根据需求进行灵活配置。
  2. 可编程接口:

    • 该芯片提供了I²C和SPI两种接口形式,使得用户可以选择适合其系统架构的通讯方式。I²C接口可以实现多个器件的从属连接,适合于多设备网络,而SPI则提供更高的速度和更短的延迟。
  3. 电源要求:

    • KSZ8863RLLI-TR 支持多种供电电压范围(1.8V,2.5V,3.3V),方便在不同的电子应用环境中使用,提高了设计的灵活性。
  4. 温度范围:

    • 该产品的工作温度范围为-40°C至85°C,适合于工业及户外环境中使用,确保设备在极端温度下的可靠运行。
  5. 封装和布局:

    • 采用LQFP-48封装,便于设计师在电路板上进行布局,且有助于减少布线复杂性,优化整体设计。该封装形式提供较高的引脚密度,使得嵌入式系统设计更加精简。

应用场景

KSZ8863RLLI-TR可广泛应用于多种行业,包括但不限于:

  • 工业自动化:在工业设备、控制器和PLC等产品中,提供稳定的网络连接。
  • 智能家居:用于智能家居设备中的网络连接管理,实现设备互联。
  • 汽车电子:在车载信息娱乐系统和汽车网络中发挥至关重要的作用。
  • 消费电子:在智能电视、音乐播放设备等消费类电子产品中提供网络能力。

技术优势

选择KSZ8863RLLI-TR,用户能够享受到以下技术上的优势:

  • 高集成度和低功耗:该芯片的集成设计,能够降低外部元器件的数量,有效降低设计成本及功耗。
  • 灵活性:多种供电电压与接口协议,为开发者提供了更大的灵活性,也方便兼容不同的设计需求。
  • 可靠性:广泛的工作温度范围及严格的工业级标准,使得该产品在各种苛刻环境下均能保持稳定性能。

结论

KSZ8863RLLI-TR 是一款全面、高效、灵活的以太网交换解决方案,适合各种嵌入式应用。借助其出色的电气性能、丰富的应用场景以及优异的工作可靠性,KSZ8863RLLI-TR 不仅能帮助设计师加速产品开发周期,而且能够提升最终产品的市场竞争力。在如今快速发展的数字化时代,该芯片将为各类现代设备提供坚实的网络基础。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.