Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ATTINY13A-SU 是一款由美国微芯科技(Microchip Technology Inc.)生产的小型8位单片微控制器(MCU),专为低功耗及小型化的应用而设计。该微控制器具备丰富的功能,适合于各种嵌入式系统以及低功耗电子设备的开发。
ATTINY13A-SU的工作电压范围为1.8V至5.5V,支持多种供电选择,适用于各种电源条件。这种灵活性使得它在电池供电的小型设备中表现出色,同时也能在较高电压的应用中稳定工作。此外,其工作温度范围为-40°C至85°C,能够在严苛环境中稳定运行,特别适合工业及户外应用。
ATTINY13A-SU的核心处理器基于AVR架构,主频可达20MHz,具备高效的处理能力。内置的程序存储容量为1KB(512 x 16),足以支持较为复杂的控制逻辑与算法。与此同时,它配备了64字节的RAM和64字节的EEPROM,用于数据存储和临时数据的处理,为开发者提供了足够的数据处理能力。
该微控制器具有多种集成功能,增强了其应用的灵活性和适用性。ATTINY13A-SU中内置的四路10位A/D转换器,使其能够直接读取模拟信号(如温度传感器、电压传感器等)的数值,为各种传感器的接入提供了便利。它还具备PWM(脉宽调制)功能,可以用于电机控制、亮度调节等场景,适用范围广泛。
在可靠性方面,ATTINY13A-SU提供欠压检测/复位(POR)和看门狗定时器(WDT),确保系统在发生错误或电压波动时能够及时重启,以提高系统的稳定性和可靠性。这些特性使得该微控制器适合在需要长时间稳定工作的设备中使用,如智能家居、便携式设备及各类自动化控制系统。
ATTINY13A-SU采用表面贴装型(SOIC-8封装),其尺寸为8-SOIC(208mil),这使其适合当前的小型化趋势,并方便在各种电路板上进行集成。小巧的封装设计使得该芯片能够在面积有限的PCB上轻松布置,从而满足工业和消费电子领域对空间和重量的严格要求。
基于广受欢迎的AVR架构,ATTINY13A-SU在开发社区中享有良好的声誉。同时,微芯科技丰富的开发工具和配套软件,例如MPLAB X IDE及相关的软件库,可以大大简化开发过程。开发者可以利用现成的库和示例代码快速上手,缩短产品的开发周期。
ATTINY13A-SU广泛应用于许多领域,包括但不限于:
综上所述,ATTINY13A-SU不仅具备强大的处理能力和多种集成功能,且在低功耗、小尺寸、高可靠性等方面表现出色。无论是在工业应用,还是在消费电子领域,这款微控制器均能够提供良好的性能支持,是便捷、高效的电气设计解决方案的优秀选择。其广泛的适用性和稳定性,必将为产品开发带来明显优势。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products