WMSIC Electronic Components

MICROCHIP AT24CM02-SSHM-T AT24CM02

ModelAT24CM02-SSHM-T
PackageSOIC-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP AT24CM02-SSHM-T
Type
MICROCHIP
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
AT24CM02-SSHM-T
Electronic Component
1
Package
SOIC-8
Electronic Component
EEPROM
Electronic Component
0.162g
Electronic Component
1
Features
Built-in (ECC); Built-in positions(POR)
Electronic Component
BM0227687595
Electronic Component
2Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT24CM02-SSHM-T 产品概述

一、主要特性

  • 接口类型:I2C(标准兼容,支持高达 1 MHz 时钟频率)
  • 存储容量:2 Mbit(256 KByte)
  • 工作电压:1.7 V ~ 5.5 V,支持低压与 5V 单电源系统
  • 写周期时间(Tw):10 ms(典型)
  • 数据保留(TDR):100 年
  • 写周期寿命:1,000,000 次
  • 工作温度范围:-40 ℃ ~ +85 ℃(工业级)
  • 品牌:Microchip(美国微芯)
  • 封装:SOIC-8

二、产品简介

AT24CM02-SSHM-T 是 Microchip 提供的一款工业级 I2C 串行 EEPROM,容量为 2 Mbit(256 KB),适合需要长期保存配置信息与参数的嵌入式系统。器件在 1.7 V 至 5.5 V 宽电压范围内稳定工作,兼容低功耗电池供电与传统 5V 总线,且支持最高 1 MHz 的 I2C 时钟,满足普通与快速传输场合的需求。其 10 ms 的典型写周期和 100 万次写入寿命,适合频繁写入但对数据保持可靠性的应用。

三、典型应用

  • 工业控制与运动控制器的参数及标定数据保存
  • 智能电表、仪器仪表的历史记录和配置存储
  • IoT 设备、无线模块的设备标识、密钥与配置存储
  • 消费电子产品的固件配置、用户设置保存
  • 汽车非关键子系统数据存储(工作温度与可靠性适配)

四、设计与使用建议

  • I2C 总线:建议在 SDA/SCL 上使用合适阻值的上拉电阻(典型 2.2 kΩ~10 kΩ,视总线长度与速度而定);在高速 1 MHz 工作下可使用较小阻值以改善边沿速率。
  • 电源与去耦:靠近芯片放置 0.1 μF 陶瓷去耦电容,保证瞬态供电稳定。
  • 写操作:单次写入时遵循器件的写周期(Tw≈10 ms),可通过读忙检测(ACK polling)减少等待时间并优化性能。
  • 数据保护:对于关键数据建议实现冗余或 CRC 校验以防止意外损坏,利用 100 年数据保留特性做长期保存设计。
  • 封装与焊接:SOIC-8 封装适用于常规 PCB 自动贴装,注意回流焊工艺和峰值温度限制(参照器件具体封装工艺说明)。

五、封装、可靠性与订购信息

AT24CM02-SSHM-T 提供 SOIC-8 商业/工业级封装,适配通用 PCB 布局与生产流程。Microchip 保证器件在指定温度与电压条件下的高可靠性,100 年数据保留与 100 万次写周期为长期部署和频繁写入场景提供硬件级保障。订购时请确认完整料号(含温度与包装后缀)及最低起订量,必要时参考 Microchip 官方数据手册获取详细时序、封装尺寸与焊接规范。

总结:AT24CM02-SSHM-T 以其宽电压、工业级温度范围、高耐久性与大容量优势,适合对数据保持时间和写寿命有严格要求的嵌入式与工业应用,是可靠的非易失性存储选项。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.