WMSIC Electronic Components

MICROCHIP ATTINY24A-SSU ATTINY24A

ModelATTINY24A-SSU
PackageSOIC-14
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP ATTINY24A-SSU
Type
MICROCHIP
Minimum package
5700 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
ATTINY24A-SSU
Electronic Component
1
Package
SOIC-14
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.281g
CPU
8 Bit
CPU
AVR
I / O
12
RAM
128Byte
Electronic Component
1
ADC
10bit
EEPROM
128Byte
Features
(BOR / LVD / LVR / LVI); positions(POR); Gate positions; Built-in General Purpose; positions(NRST); Programmable Gate; Built-in Temperature Sensor
Electronic Component
BM0000231495

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ATTINY24A-SSU 产品概述

一、产品简介

ATTINY24A-SSU 是一款由美国微芯(Microchip Technology Inc.)生产的小型单片机(MCU),其核心架构基于 AVR 处理器,专为低功耗和小型嵌入式系统设计。该产品特别适合需要灵活性和高效能的应用场景,如消费电子、家电、工控以及医疗设备等。ATTINY24A-SSU 的工作电压范围为 1.8V 至 5.5V,支持多种操作条件,能够在-40°C至85°C的广泛温度范围内稳定工作,确保其在严苛环境下的可靠性。

二、主要特点

  1. 存储与处理能力

    • 程序存储容量: 2KB(1K x 16),采用高效的闪存技术,支持重复编程与擦除,满足多次应用更改的需求。
    • EEPROM 容量: 128 x 8,用于存储在断电后仍需保留的数据,如配置设置和用户数据。
    • RAM 大小: 128 x 8,为数据操作和计算提供足够的临时存储空间。
  2. 电气特性

    • 电压范围: 供电电压为 1.8V 至 5.5V,能够适配多种电源输入条件,同时实现低功耗操作。
    • 速度: 在 20MHz 的振荡器频率下,提供快速的计算能力,能有效支持复杂的算法和数据处理。
  3. 外设功能

    • 欠压检测/复位(POR): 提升系统可靠性,确保在供电不足时安全重启。
    • 脉宽调制(PWM): 支持多通道PWM输出,适合用于电机控制、灯光调节等应用。
    • 温度传感器: 内部集成温度传感器,便于环境监测与控制。
    • 看门狗定时器(WDT): 用于增强系统稳定性,防止由于软件错误造成的死锁。
    • 模拟数字转换器(A/D, 8x10b): 提供 8 路 10 位 A/D 转换能力,方便对模拟信号的采集和处理。
  4. 接口能力

    • I/O 数: 提供 12 个 I/O 端口,灵活支持多样的外部设备接口,适合多种控制和监测场景。
    • 连接能力: 采用 USI(通用串行接口),支持与其他设备进行高效的数据通讯。
  5. 封装与安装

    • 安装类型: 采用表面贴装型(SOIC-14),便于在现代紧凑型电路板上的应用,节省空间且易于制造。
    • 封装尺寸: 14-SOIC 封装设计,使得该芯片适合于多种小型化产品中的设计应用。

三、应用领域

由于其优势和配置,ATTINY24A-SSU 广泛应用于各种嵌入式系统中,包括但不限于:

  • 工业自动化: 适合用于传感器节点、工控仪表等,能够实时监测和控制工业环境。
  • 智能家居: 可作为智能设备的控制核心,实现对家居环境的智能化管理。
  • 消费电子产品: 在数码相框、玩具、家用电器等小型设备中担任控制功能。
  • 便携式设备: 低功耗特性使其非常适合用于电池供电的便携式产品。

四、总结

ATTINY24A-SSU 是一款功能丰富、灵活高效、供电电压宽范围的小型单片机,为现代电子工程师提供了极大的便利。凭借其低功耗、高性能特性和广泛的应用适应性,使其成为多种电子产品和嵌入式系统设计的理想选择。无论是在消费电子还是工业领域,其可靠性和灵活性都将为用户带来极大的价值。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.