WMSIC Electronic Components

MICROCHIP MCP6L91T-E/OT MCP6L91T

ModelMCP6L91T-E/OT
PackageSOT-23-5
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP MCP6L91T-E / OT
Type
MICROCHIP
Unit
Electronic Component
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP6L91T-E/OT
Electronic Component
1
Package
SOT-23-5
Electronic Component
Operational Amplifier
Electronic Component
0.043g
Electronic Component
1
Electronic Component
Output
Electronic Component
BM0265297011
Operating Temperature
40℃~+125℃
Amplifier
1
Output Current
25mA
(SR)
7V/us
Power Supply Voltage
2.4V~6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP6L91T-E/OT 产品概述

一、概况

MCP6L91T-E/OT 是 MICROCHIP(美国微芯)推出的一款单路精密运算放大器,封装为 SOT-23-5。器件支持轨到轨输入与轨到轨输出,单电源工作电压范围为 2.4V 至 6V(最大电源宽度 6V),并在工业级温度范围 -40℃ 至 +125℃ 下稳定工作,适合便携及工业应用。

二、主要性能亮点

  • 增益带宽积(GBP):10 MHz,适合中等速率信号处理。
  • 压摆率(SR):7 V/µs,能满足多数信号整形与驱动要求。
  • 输入偏置电流(Ib):1 pA,输入失调电流(Ios):1 pA,适用于高阻传感器接口与电流积分电路。
  • 输入失调电压(Vos):1 mV,温漂(Vos TC):1.3 µV/℃,具备良好直流精度。
  • 噪声密度:9.4 nV/√Hz @ 10 kHz,低噪声特性利于精密测量。
  • 静态电流(Iq):850 µA,输出驱动能力达 25 mA,兼顾功耗与负载驱动能力。
  • 共模抑制比(CMRR):91 dB,保证差模误差抑制。

三、典型应用场景

  • 高阻抗传感器缓冲(电化学传感器、玻璃电极、热敏电阻网络)。
  • 光电二极管跨阻放大(中速光电检测)。
  • 精密电平移位、DAC/ADC 缓冲与前端放大。
  • 主动滤波器、峰值检测与信号整形电路。
  • 便携式测量仪器与电池供电系统。

四、设计与布局建议

  • 电源引脚应靠近芯片放置旁路电容(0.1 µF 与 1 µF 配合),以降低电源噪声。
  • 对高阻输入使用防漏设计:缩短输入走线、使用护环/地平面、必要时采用 PCB 覆盖或清洁以抑制表面泄漏。
  • 在跨阻或高增益配置中,注意反馈电阻与电容选择以兼顾稳定性和带宽,参考 10 MHz GBP 与 7 V/µs SR 的限制。
  • 封装为 SOT-23-5,有利于体积受限设计,但布线时注意热散与焊盘一致性以确保可靠焊接与热性能。

五、选型与封装信息

  • 型号:MCP6L91T-E/OT(MICROCHIP)
  • 封装:SOT-23-5,单路运放。
  • 工作温度:-40℃ ~ +125℃。
    本器件在需要低输入偏置、轨到轨 I/O 以及中等速度/低噪声要求的系统中具有很高的性价比。购买时请参考官方数据手册以获取典型电路、引脚排列与完整电气特性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.