Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICROCHIP PIC16F1933-I/SS PIC16F1933
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MICROCHIP PIC16F1933-I / SS
- Type
- MICROCHIP
- Unit
- Electronic Component
- Minimum package
- 4700 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MICROCHIP
- Electronic Component
- PIC16F1933-I/SS
- Electronic Component
- 1
- Package
- SSOP-28-208mil
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0g
- CPU
- 8 Bit
- CPU
- PIC
- I / O
- 25
- Electronic Component
- 1
- ADC
- 10bit
- EEPROM
- 256Byte
- Electronic Component
- BM69415834
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：PIC16F1933-I/SS
概述
PIC16F1933-I/SS 是由美国微芯科技（Microchip Technology Inc.）推出的一款高性能、低功耗的8位单片机（MCU），专为嵌入式控制应用设计。该器件结合了丰富的外设资源与灵活的连接能力，广泛应用于家电、汽车电子、工业控制和消费电子等领域。
主要特点
处理器核心与性能
- PIC16F1933 采用8位PIC核心结构，基于微芯公司的高效RISC架构，主频高达32MHz，用户可以在较低的功耗下实现快速的数据处理。这使其在性能和功耗之间实现了良好的平衡，适合需要实时响应的控制任务。
丰富的连接能力
- PIC16F1933支持多种通信接口，包括I²C、LINbus、SPI、UART/USART等，使得它能够方便地与各种传感器、执行器和其他外围设备进行连接。这种灵活的连接能力特别适合需要多种通讯方式的复杂系统。
内存资源
- 内置7KB的闪存程序存储器（4K x 14），256字节的EEPROM以及256字节的RAM，提供了充足的存储空间来实现各种应用程序与数据存储需求。这使得开发者可以在单片机内实现复杂的控制逻辑与数据处理。
外设功能
- 本器件集成了欠压检测、LCD驱动、上电复位电路、脉宽调制（PWM）输出以及看门狗定时器（WDT）等多种外设功能。这些功能的集成不仅简化了系统设计，还提升了系统的可靠性与稳定性。
数据转换器
- PIC16F1933内置11路10位的模数转换器（A/D），可以对模拟信号进行精确采样和转换，在需要模拟信号处理的应用中尤其有用。
工作环境与供电要求
- 该器件的工作电压范围为1.8V至5.5V，适应性强，能够满足不同工作环境的需求。同时，-40°C至85°C的宽工作温度范围适合于工业及户外环境中使用，保证了其在各种严苛条件下的稳定运行。
封装与易用性
- PIC16F1933采用28-SSOP（0.209"，5.30mm宽）封装类型，具有良好的空间利用率，适合密集的电路板设计。此外，表面贴装型的设计使得其在现代电子产品的组装中更为便捷，适合大规模生产。
应用领域
PIC16F1933在多个领域均有广泛应用，尤其是在：
- 家电控制：如洗衣机、冰箱中温度和状态监控；
- 汽车电子：如车载信号处理、传感器接口及控制单元；
- 工业自动化：机器控制、数据采集系统；
- 消费电子：智能玩具、可穿戴设备等。
总结
PIC16F1933-I/SS 作为一款功能强大的8位单片机，凭借其高性能低功耗的特性、丰富的外设和良好的连接能力，能够满足现代嵌入式系统对于处理能力、通讯能力和节能要求的需求。其广泛适用的温度范围及简易的安装方式使其在多种应用场景中具有显著的优势，是设计师和工程师的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
