Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCP1703T-3302E/DB 是由美国微芯科技(Microchip Technology Inc.)设计的一款高性能线性稳压器(LDO),具有固定输出电压。它专为数字电路供电而设计,适用于要求稳定电压、低噪声和高效率的应用场合。该元件采用SOT-223-3封装,适合表面贴装,整体设计旨在节省空间,同时提供可靠的散热性能。
MCP1703T-3302E/DB 的输入电压范围为最大16V,适合多种电源电压环境。其输出电压固定为3.3V,提供高达250mA的输出电流,满足大多数低功耗电子设备的需求。通过其极低的电压降(最大值为0.725V @ 250mA),实现高效的电源转换,从而将电能损耗降至最低。
该产品还具有极低的静态电流(Iq),仅为5µA,适合于电池供电的应用,能够有效延长设备的电池使用寿命。此外,其PSRR(电源抑制比)高达44dB(在100Hz频率下),表明该稳压器在抑制输入电压波动方面表现优异,极大提高了输出电压的稳定性。
MCP1703T-3302E/DB设计有多重保护功能,包括过流保护、过温保护和短路保护,确保在不同工作条件下的安全性和可靠性。这样的设计不仅可以保护元件本身,还能有效维护整个电路的安全运作,减少因电源波动或过载导致的故障。
该稳压器的工作温度范围为-40°C至125°C,使其在严苛的环境条件下(如工业、汽车、消费电子等领域)依旧可靠运行。广泛的温度适应性保证了其在各种应用场景中的稳定性,这使得MCP1703T-3302E/DB成为重要组件,尤其适合需要高温或低温操作的设备。
MCP1703T-3302E/DB 可广泛应用于多种电子设备,例如:
采用SOT-223-3封装的MCP1703T-3302E/DB,具备良好的散热特性,适合高密度印刷电路板(PCB)设计。其小巧的尺寸极大地节省了 PCB 空间,为设计师提供更多的设计灵活性。
总体而言,MCP1703T-3302E/DB 是一款高效、可靠的小型线性稳压器,凭借其优异的电气特性和多重保护方案,适应多种应用场景,并确保高质量的电源供应。无论是在便携式设备、工业控制还是汽车电子中,它都将成为理想的电源管理解决方案,有力支撑现代电子产品对性能和效率的高要求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products