WMSIC Electronic Components

MICROCHIP MIC5504-2.8YM5-TR MIC5504

ModelMIC5504-2.8YM5-TR
PackageSOT-23-5
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MIC5504-2.8YM5-TR
Type
MICROCHIP
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
160mV@(300mA)
Electronic Component
MICROCHIP
Electronic Component
175uVrms
Electronic Component
MIC5504-2.8YM5-TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.043g
Electronic Component
1
Features
Output
Electronic Component
BM0247661654
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
2.8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MIC5504-2.8YM5-TR 产品概述

一、产品简介

MIC5504-2.8YM5-TR 为美国微芯(Microchip)推出的一款高性能固定输出线性稳压器(LDO)。该器件在小体积 SOT-23-5 封装内提供单路正向 2.8V 稳压输出,适合对噪声、纹波抑制和低静态电流有要求的便携与嵌入式系统。器件支持使能控制,并具备过热与过流保护,可靠性高,易于系统集成。

二、主要性能参数

  • 输出类型:固定(2.8V)
  • 最大工作电压(输入):5.5V
  • 最大输出电流:300mA
  • 压差(Dropout):160mV @ 300mA
  • 静态电流(Iq):38µA(典型,低功耗)
  • 电源纹波抑制比(PSRR):60dB @ 1kHz
  • 输出噪声:175µVrms
  • 工作温度范围:-40°C ~ +125°C(Tj)
  • 输出极性:正极,单通道
  • 封装:SOT-23-5

三、关键特性与保护

  • 带使能(EN)引脚:可实现电源输出的快速启停控制,降低待机功耗,便于电源域管理。
  • 过热保护(Thermal Shutdown):在过温条件下自动关断,防止器件和系统损毁。
  • 过流保护(Current Limit):在输出短路或大负载冲击时限制电流,增强系统安全性。
  • 低压差特性与高 PSRR:160mV 的低压差在高负载下仍能保持稳定输出,60dB@1kHz 的 PSRR 有利于抑制外部电源纹波,适合对敏感模拟或 RF 前端供电。

四、封装与引脚信息

MIC5504-2.8YM5-TR 提供 SOT-23-5 小尺寸封装,便于空间受限的移动设备与消费类电子产品布局。实际设计中,应参考器件数据手册确认引脚排列与接地/热流路径,确保良好的散热与稳定工作。

五、典型应用与设计注意事项

  • 典型应用:便携式设备、手持终端、微控制器供电、传感器前端、模/数混合电路的后级整流或去耦、低噪声模拟电源。
  • 输入/输出电容:为保证稳定性和瞬态响应,建议在输入与输出端使用低 ESR 陶瓷电容并靠近器件封装放置(请参照官方数据手册确认最小与推荐容值范围)。
  • 热量管理:在高 Vin–Vout 差和大电流条件下,LDO 损耗显著(P = (Vin−Vout)×Iout),SOT-23-5 封装热阻较大,设计时需评估功耗与散热(可通过降低压差、分担负载或改进 PCB 热铜分布来缓解)。
  • 使能与软启动:利用 EN 引脚实现电源排序与省电模式;若系统对上电浪涌敏感,可在 EN 或输出端配合软启动电路以限制启动电流。

六、选型建议与订购信息

MIC5504-2.8YM5-TR 适用于要求低静态电流、良好纹波抑制和中等输出电流(≤300mA)的应用场景。当系统需在窄压差下工作且空间受限时,本器件为优选方案。采购与替代时请参照 Microchip 官方数据手册确认完整电气特性、引脚定义与推荐外围元件以保证系统性能与可靠性。

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