WMSIC Electronic Components

MICROCHIP MCP42010T-I/SL MCP42010T

ModelMCP42010T-I/SL
PackageSOIC-14
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MCP42010T-I / SL
Type
MICROCHIP
Minimum package
2600 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP42010T-I/SL
Electronic Component
1
Package
SOIC-14
Electronic Component
1MHz
Electronic Component
positions
Electronic Component
0.292g
Electronic Component
10kΩ
Electronic Component
256
Electronic Component
1
Channel Count
2
Features
positions; positions
Electronic Component
BM0259720889
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP42010T-I/SL 产品概述

简介

MCP42010T-I/SL是由美国微芯科技(Microchip Technology Inc.)推出的一款高性能数字电位器,主要用于精确的电阻调节和信号处理。这款设备采用SPI接口,支持高级电路配置,适用于多种工业及消费类电子产品的设计和开发。

主要特性

  1. 电阻值与电路数: MCP42010T-I/SL内置两个独立的10kΩ电位器,具有256个抽头可供选择。在实际应用中,设计师可以根据需要精确调节电位器,以满足不同的电阻需求。

  2. 温度特性: 该器件的典型温度系数为800ppm/°C,这意味着在广泛的工作温度范围内(-40°C至85°C),其性能会保持稳定,适合于恶劣环境下的应用。

  3. 接口和配置: 通过SPI接口与微控制器或其他数字电路进行通信,使得电位器的调整和设置变得更加灵活和简便。该数字电位器支持级联配置,能够满足更复杂电路设计的需要。

  4. 供电电压: 工作电压范围为2.7V至5.5V,确保其能够与各种供电方案兼容,适应不同的应用场合。

  5. 存储器类型: MCP42010T-I/SL使用的是易失性存储器,这意味着在断电后,设备会失去其设置的内容。在一些要求较高的应用中,设计师可以通过适当的设计来处理这一特性。

  6. 电阻触点: 该产品的典型触点电阻为73Ω,这使得其在信号传输过程中具备较低的信号损耗,从而提高总体性能。

应用场景

MCP42010T-I/SL数字电位器适用于多种应用场合,包括但不限于:

  • 音频设备: 在音响系统中,可用于音量调节和均衡器设置。
  • 射频设计: 在无线电、通信和射频应用中进行阻抗调节和匹配。
  • 工业控制系统: 用于传感器输入、信号调理和其他需要调节的参数设置。
  • 消费电子产品: 可用于显示器的亮度控制、温度调节和其他人机交互界面。

设计优势

MCP42010T-I/SL数字电位器的设计优势在于其小巧的SOIC封装使得其在电路板设计中占用更小的空间。此外,数字接口的使用使得在控制精度、速度以及多通道应用中具有较强的灵活性。有助于减少元器件数量,提高产品可靠性和降低生产成本。

总结

总之,MCP42010T-I/SL是一款在性能、灵活性和可靠性上都表现优异的数字电位器,适合于各种电子产品的开发需求。凭借其高精度的调节能力和广泛的应用范围,它将在未来的电子设计中扮演重要角色。对于工程师而言,选择这一器件意味着能够更加高效和精准地实现产品设计目标,推动项目的成功实施。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.