Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICROCHIP MCP604T-I/SL MCP604T
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MICROCHIP MCP604T-I / SL
- Type
- MICROCHIP
- Unit
- Electronic Component
- Minimum package
- 2600 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MICROCHIP
- Electronic Component
- MCP604T-I/SL
- Electronic Component
- 1
- Package
- SOIC-14
- Electronic Component
- Operational Amplifier
- Electronic Component
- 0.292g
- Electronic Component
- 1
- Electronic Component
- Output
- Features
- Built-in
- Electronic Component
- BM0000281944
- Operating Temperature
- 40℃~+85℃
- Amplifier
- 4
- Output Current
- 22mA
- (SR)
- 2.3V/us
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCP604T-I/SL 产品概述
1. 产品简介
MCP604T-I/SL 是由美国微芯（Microchip Technology Inc.）推出的一款高性能四通道运算放大器。该产品以其极低的输入偏置电流（仅为1pA）和广泛的工作温度范围（-40°C ~ 85°C）而闻名，特别适合需要高精度和高稳定性的应用场合。其增益带宽积（GBP）为2.8MHz，保证了在多种信号处理场合下都能实现良好的性能。
2. 主要特点
- 通道数：MCP604T-I/SL 集成四个运算放大器，可在单一芯片上处理多路信号，节省电路板空间。
- 增益带宽积：高达2.8MHz 的增益带宽积，适用于频率较高的信号放大场合。
- 压摆率：具有2.3V/µs 的压摆率，满足快速信号处理需求，确保快速响应和准确的信号跟踪。
- 输入偏置电流和补偿电压：输入偏置电流仅为1pA，电压补偿为700µV，这使得该运算放大器在精密放大和低噪声应用中表现出色。
- 输出类型：支持满摆幅输出（Rail-to-Rail），能够处理从电源轨到电源轨的全范围信号，适合于低电源电压应用。
- 功耗：每通道功耗仅为230µA，具有较低的能耗，有助于延长电池供电设备的使用寿命。
- 宽电压供电范围：支持2.7V到6V的电源电压，以适应多种电源设计。
- 温度范围：设备支持 -40°C 到 85°C 的工作温度，适合极端环境的应用。
3. 应用领域
MCP604T-I/SL 运算放大器的多种特性使其可以广泛应用于以下领域：
- 传感器信号处理：其低噪声和高输入阻抗特性，使其非常适合于处理来自传感器的微弱信号。
- 消费电子：在便携式设备和家庭电子产品中，因其低功耗和小型封装优势，可以广泛用于音频放大、信号调理等电路。
- 医疗设备：对于医疗监测和诊断设备，运算放大器的高精度和稳定性提供了解决方案。
- 工业控制：在工业自动化和嵌入式系统中，用作模拟信号的处理与放大。
4. 封装与安装
MCP604T-I/SL 采用14-SOIC（Small Outline Integrated Circuit）封装形式，适合表面贴装（SMD）技术，方便现代化的电路板设计与生产。其小巧的体积可以轻松嵌入到复杂的电路中，特别是在空间受限的应用场合。
5. 总结
MCP604T-I/SL 运算放大器以其卓越的性能特点、低功耗设计以及多功能性，为各种电子应用提供了理想的解决方案。无论是在高频信号处理还是低功耗电路设计中，该器件都顯示出其优越性，是现代电子设计中不可或缺的组成部分。选择 MCP604T-I/SL，意味着选择了高效率、稳定性和可靠性，为产品的成功应用提供了保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
