WMSIC Electronic Components

MICROCHIP MCP1825ST-3302E/DB MCP1825ST

ModelMCP1825ST-3302E/DB
PackageSOT-223-3
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MCP1825ST-3302E / DB
Type
MICROCHIP
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
350mV@(500mA)
Electronic Component
MICROCHIP
Electronic Component
MCP1825ST-3302E/DB
Electronic Component
1
Package
SOT-223-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.25g
Electronic Component
1
Electronic Component
BM0218396945
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
6V
Output
Electronic Component
Output Voltage
3.3V
Output Current
500mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MCP1825ST-3302E/DB

在现代电子设计中,线性稳压器(LDO)是一种不可或缺的关键元件。它们广泛应用于供电管理、电压转换和信号调理等领域。MCP1825ST-3302E/DB是由著名的半导体制造商MICROCHIP(美国微芯)所推出的一款高性能固定输出稳压器,具有卓越的性能和灵活的应用能力。

主要特性

MCP1825ST-3302E/DB的核心特性包括:

  • 固定输出电压:该LDO的输出电压为3.3V,适合广泛的应用场景,如微控制器供电、传感器、电源管理系统等。

  • 输出电流能力:产品能够提供最高500mA的电流输出,确保能为各种负载提供稳定的电源,满足一般消费电子项目和工业应用的需求。

  • 输入电压范围:其输入电压范围为最大6V,支持多种电源电压选项,使得系统设计更加灵活。

  • 低压降特性:该稳压器在500mA输出下的最大电压降为0.35V,保证了在负载变化和输入电压波动情况下,输出电压的稳定性。

  • 运行温度范围:MCP1825ST-3302E/DB可在-40°C至125°C的温度范围内可靠工作,适应各种环境条件,适合于工业和汽车电子领域。

  • 静态电流:其静态电流(Iq)仅为220µA,展现出对低功耗设计的友好特性,是便携式设备和低功耗应用的理想选择。

  • 良好的电源抑制比(PSRR):在100Hz下的PSRR为60dB,表示其对输入电压变化的抵抗能力强,有效减少电源噪声对输出的影响,提升了整个系统的性能和可靠性。

保护功能

MCP1825ST-3302E/DB还具备一系列保护功能,包括:

  • 超温保护:在过高温度情况下,自动限制输出,防止设备损坏。

  • 短路保护:当输出端短路时间过长时,稳压器能够自我保护,限制电流输出,降低故障风险。

  • 欠压锁定(UVLO):当输入电压低于某一安全预设值时,LDO将停止输出,以防止设备在不稳定状态下运行,从而保护连接的电子组件。

封装与安装

该产品采用SOT-223-3封装,体积小巧,适合于表面贴装技术(SMT),方便在现代印刷电路板(PCB)上进行高效集成。这种紧凑的封装设计不仅节省了空间,更有助于提高电子设备的整体性能和可靠性。

应用场景

MCP1825ST-3302E/DB的广泛应用场景包括:

  • 消费类电子产品:如便携式设备、智能手机、平板电脑等。

  • 工业自动化:用于传感器、控制器和数据采集设备的电源管理。

  • 汽车电子:适用于汽车仪表盘、娱乐系统以及其他电源敏感的电子组件。

  • 通信设备:在无线设备和网络设备中,确保稳定的电源供应。

在当前和未来的电子设计中,MCP1825ST-3302E/DB凭借其卓越的性能、出色的保护特性和适应性,为设计师提供了一个可靠而高效的解决方案。无论是在消费电子、汽车电子还是工业应用,其灵活性和稳定性都能满足多种需求,是现代电子工程师的理想选择。

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