Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICROCHIP 24LC256T-E/SN 24LC256T
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICROCHIP 24LC256T-E / SN
- Type
- MICROCHIP
- Minimum package
- 3300 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MICROCHIP
- Electronic Component
- 24LC256T-E/SN
- Electronic Component
- 1
- Package
- SOIC-8
- Electronic Component
- EEPROM
- Electronic Component
- 0.335g
- Electronic Component
- 1
- Electronic Component
- BM0264573641
- Electronic Component
- 256Kbit
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 2.5V~5.5V
- Interface Type
- I2C
- Electronic Component
- 100
- Clock Frequency(fc)
- 400kHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
24LC256T-E/SN 产品概述
一、概述
24LC256T-E/SN 为 MICROCHIP（美国微芯）出品的工业级串行 EEPROM 存储器，容量 256Kbit（32K x 8），采用 I2C 总线接口，封装为 SOIC-8。器件工作电压范围宽（2.5V～5.5V），工作温度覆盖工业级 -40℃～+125℃，适合各种需长期可靠存储配置与参数的嵌入式应用。
二、主要参数
- 存储容量：256Kbit（32K x 8）
- 接口类型：I2C，总线时钟频率 fc = 400kHz（Fast-mode）
- 写周期时间 Tw：最大 5ms（典型页写等待时间）
- 数据保留：TDR = 200 年
- 写周期寿命：1,000,000 次（耐久性高）
- 工作电压：2.5V ～ 5.5V
- 工作温度：-40℃ ～ +125℃
- 封装：SOIC-8（管脚兼容常见 8 引脚 EEPROM）
三、功能特点
- 硬件写保护：带独立 WP（Write Protect）引脚，可通过外部电平实现对整个器件或部分地址空间的写保护，提升数据安全性。
- 噪声抑制：内部具有噪声抑制/滤波机制，提高在工业噪声环境下的通信可靠性。
- 标准 I2C 协议兼容，支持多主多从拓扑，易于与 MCU、FPGA 等外设连接。
- 低功耗待机，适合电池供电或功耗敏感场景。
四、典型应用
- 嵌入式系统配置和参数存储（如生产校准数据、设备 ID）
- 工业控制器、计量设备的数据记录与备份
- 通信设备、消费电子的固件微参数保存
- 汽车与物联网终端（在满足系统级认证的前提下）
五、设计与使用建议
- I2C 总线需配置合适的上拉电阻（典型 2k～10kΩ，视速率与电容而定），并考虑总线上的时序裕度；
- 未使用的地址引脚建议根据需要拉高或拉低以设定器件地址，若无地址引脚（封装或版本差异），以数据手册为准；
- 写操作后遵循 Tw（最大 5ms）完成时间，或通过读取器件内部忙标志（若支持）确认写入完成，避免后续操作冲突；
- 对关键数据使用硬件写保护（WP）或软件机制（校验与双备份）以防误写；
- 在高噪声环境下，布线时尽量缩短 SDA/SCL 走线并避开高电流回路，必要时在总线输入端增加滤波或共模抑制措施。
六、封装与采购提示
24LC256T-E/SN 常见为 SOIC-8 封装，适合手工贴装或自动贴装生产。采购时注意品名后缀（封装、分装方式、温度等级）与正规供应链渠道，以确保器件为原厂正品并具备相应的技术文档与可靠性支持。
以上为 24LC256T-E/SN 的产品概述，若需详细电气特性、时序图或参考电路图，请参阅 MICROCHIP 官方数据手册或提供具体应用场景，我可为您给出更精确的设计建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
