Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PIC18F45K80-I/PT 是一款功能强大的 8 位单片机(MCU),由美国微芯(Microchip Technology Inc.)公司设计和生产。该器件采用表面贴装型封装(44-TQFP,10x10mm),具备广泛的应用场景,包括工业控制、消费电子、汽车电子等领域。凭借其灵活的 I/O 配置、丰富的外设集成、低功耗特性及广泛的工作温度范围,该芯片在多种嵌入式系统中展现出优越的性能。
高性能内核
PIC18F45K80 配备了一个高效的 8 位核心,具有最高 64MHz 的运行速度。在此速度下,芯片能够快速处理数据和执行复杂的控制逻辑,适应多种实时应用需求。
存储能力
该产品提供 32KB 的程序存储容量(16K x 16),配合 3.6KB 的 RAM(3.6K x 8),使其能够运行复杂的应用程序和数据处理任务。此外,1KB 的 EEPROM(1K x 8)允许用户持久存储重要的数据,从而实现更多的业务逻辑。
丰富的外设与接口
PIC18F45K80 集成了多种外设,包括欠压检测/复位(LVD)、上电复位(POR)、脉宽调制(PWM)、看门狗定时器(WDT),以及 11 路 12 位的 A/D 转换器,进一步增强了其功能。此外,连通能力涵盖了 ECANbus、I²C、LINbus、SPI 和 UART/USART,为设备之间的数据交流提供了多样的选项。
电源管理
该 MCU 的供电电压范围广泛,介于 1.8V 至 5.5V 之间,使其在低功耗应用中拥有良好的适应性。同时,具备的欠压检测功能能有效确保系统的稳定运行。
工作温度范围
PIC18F45K80 设计工作温度范围为 -40°C 到 85°C,符合多种恶劣环境下的工作需求,适合工业和汽车等应用领域。
内部振荡器
该单片机采用内部振荡器,简化了外部组件的需求,方便了电路设计,提高了系统的可靠性。
PIC18F45K80 的多功能外设和强大的处理能力使其适用于多种应用,包括但不限于:
总之,PIC18F45K80-I/PT 是一款高性能的 8 位单片机,具备丰富的功能和强大的存储能力,适用于各种应用场景。其在工业控制、消费电子和汽车电子等领域的广泛适用性,使其成为设计师和工程师的理想选择。随着物联网和智能设备的快速发展,PIC18F45K80 将继续在未来嵌入式系统中扮演至关重要的角色。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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