WMSIC Electronic Components

MICROCHIP 93LC66B-I/SN 93LC66B

Model93LC66B-I/SN
Package8-SOIC
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP 93LC66B-I / SN
Type
MICROCHIP
Unit
Electronic Component
Minimum package
100 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
93LC66B-I/SN
Electronic Component
1
Package
8-SOIC
Electronic Component
EEPROM
Electronic Component
0.07g
Electronic Component
1
Electronic Component
BM0258687685
Electronic Component
4Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Interface Type
SPI
Electronic Component
100
Clock Frequency(fc)
3MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

93LC66B-I/SN 产品概述

一、主要特性

93LC66B-I/SN 是 MICROCHIP(美国微芯)生产的一款串行 EEPROM,存储容量 4Kbit(512 字节),采用 8-SOIC 封装,工作电压范围宽(2.5V ~ 5.5V),适合工业级应用(工作温度 -40℃ ~ +85℃)。器件支持 SPI/Microwire 类串行接口,标称时钟频率可达 3MHz(市场描述也常见 2MHz 标注,实际设计请以官方数据手册为准)。典型写周期时间为 6ms,数据保留(TDR)高达 200 年,写入寿命达到 1,000,000 次,可靠性优异。

二、功能与接口

该器件提供标准的串行时钟(SCK)、片选(CS)、数据输入/输出(DI/DO)引脚,便于与 MCU、FPGA 等主控设备直接通信。内部采用非易失性电存储结构,支持字节写入与读取,适用于保存校准参数、设备 ID、配置信息和小容量日志等。

三、电气与时序要点

  • 工作电压:2.5V ~ 5.5V,支持 3.3V 与 5V 系统直接接口,便于系统兼容设计。
  • 最大时钟频率:按提供信息为 3MHz(部分资料显示 2MHz);为保证稳定通信,建议按实际系统时序与器件数据表配置。
  • 写周期(Tw):典型 6ms,系统在写操作期间应禁止断电与不当总线操作以免写入失败。
  • 数据保持(TDR):200 年(典型),适合长期存储应用。
  • 擦写/写入寿命:1,000,000 次,适合频繁写入场景。

四、封装与散热

器件为 8-SOIC(工业级引脚间距与外形),便于手工焊接与贴片生产。考虑到 EEPROM 本身功耗较低,但建议在布局时为器件预留合适的地平面与去耦电容(0.1μF)以确保电源稳定,尤其在写周期内电源瞬态会影响写入可靠性。

五、典型应用场景

  • 工业控制器与仪器的参数存储(校准系数、配置表)
  • 消费电子的序列号与出厂设置保存
  • 通信设备与模块的配置信息与固件小段保存
  • 需要长数据保留与高写入寿命的嵌入式系统

六、设计与使用建议

  • 强烈建议参考 MICROCHIP 官方数据手册以确认时序与电气极限(尤其时钟频率差异)。
  • 在写入期间保证稳定电源并避免复位/断电,必要时通过硬件上电管理或电容缓冲处理。
  • 总线连接中加入适当上拉/下拉与串联阻抗(如 33Ω)以抑制振铃与改善信号完整性,尤其在高速时钟(接近 MHz 级)下。
  • 若需多器件挂载同一总线,注意片选信号的独立控制与防止总线冲突。

总结:93LC66B-I/SN 以其宽电压范围、长数据保持、超高写入寿命和工业级温度范围,适合对可靠性与长期存储要求较高的嵌入式与工业应用。在设计中以厂商数据手册为准,配合良好的电源与 PCB 布局可获得最佳性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.