Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MICROCHIP的PIC16F616T-I/SL是一款高性能、低功耗的8位单片机(MCU),专为各种嵌入式应用设计。该MCU采用14-SOIC封装,尺寸为0.154英寸(3.90mm宽),提供了便于PCB布局和集成的优良特性。其核心处理器为PIC系列,最大运行速度可达20MHz,适合于中低速率的控制和处理任务。
PIC16F616T-I/SL的核心采用8位架构,支持多种控制和计算操作。其最大时钟频率为20MHz,确保了较高的处理速度,使其能够高效执行复杂的控制逻辑。配备11条通用输入/输出(I/O)引脚,灵活应对多种外设和接口要求,从而极大地提升了其在各种应用中的适用性。
该MCU具备3.5KB的程序存储容量(2K x 14),采用闪存存储器类型,可以进行多次编程和擦除,适合于需要频繁更新固件的应用。同时,还配备了128字节的RAM(128 x 8),满足中小型数据处理的需求。这种内存结构对资源有限的嵌入式系统尤为适合,使其在执行复杂算法和数据处理时仍能保持高效。
PIC16F616T-I/SL内置多种外设功能,提供欠压检测、复位(POR)、脉宽调制(PWM)、以及看门狗定时器(WDT)等重要功能。这些外设设计使得该MCU可以在各种磁场和电源环境下稳定运行。同时,内置的8通道10位模数转换器(A/D)支持模拟信号的获取,使其能够在需要模拟与数字信号转换的应用中表现出色。
该MCU的电源电压范围为2V至5.5V,在低功耗和低电压操作方面表现优越,适合于电池供电的便携设备。此外,其工作温度范围为-40°C到85°C,极大地拓展了其在恶劣环境下的应用可能性。无论是在严寒的室外环境,还是高温的工业设备中,PIC16F616T-I/SL都能保持可靠的性能。
该单片机采用表面贴装技术(SMD),便于在现代电子装置中进行高密度设计。其湿气敏感性等级为1,表明该元器件具有较强的环境适应性,合适的存储条件下可以实现长期保留。
基于其优越的性能和灵活的功能,PIC16F616T-I/SL广泛应用于多个领域,如家电控制、工业自动化、智能仪器、传感器接口、车辆电子等。它能够满足各类嵌入式需求,支持从基础的开关控制到复杂的信号处理。
综上所述,MICROCHIP的PIC16F616T-I/SL单片机凭借其强大的处理能力、丰富的存储和外设组合,以及适应广泛工作环境的能力,是高效、灵活的解决方案,适合需要高度集成和低功耗的多种嵌入式应用。通过充分利用此MCU的特性,设计工程师能够在开发新产品时提高性能并缩短开发周期,从而在竞争激烈的市场中占得先机。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products