WMSIC Electronic Components

MICROCHIP 24AA02UIDT-I/OT 24AA02UIDT

Model24AA02UIDT-I/OT
PackageSOT-23-5
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP 24AA02UIDT-I / OT
Type
MICROCHIP
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
24AA02UIDT-I/OT
Electronic Component
1
Package
SOT-23-5
Electronic Component
EEPROM
Electronic Component
0.022g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0000001148
Electronic Component
2Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
400kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

24AA02UIDT-I/OT 产品概述

概述

24AA02UIDT-I/OT 是由美国微芯 (Microchip Technology) 生产的一款高性能 EEPROM 存储器,它采用 I²C 接口和 SOT-23-5 封装,拥有 2Kb 的存储容量,设计用于各种低功耗和中等容量的数据存储应用。其宽广的供电电压范围和工作温度,使其在工业、消费电子、汽车、医疗等多种领域中表现出色。

存储器技术

作为一种非易失性存储器,24AA02UIDT-I/OT 采用 EEPROM 技术,能够在断电情况下保持存储的数据。相较于其他类型的存储器,如 SRAM,EEPROM 提供了更长的数据保持时间和更低的能耗。该器件支持字和页写入模式,写入周期时间为 5 毫秒,访问时间则为 900 纳秒,能够满足大多数应用的实时性要求。

存储容量与结构

24AA02UIDT-I/OT 的存储容量为 2Kb,这意味着其具有 256 个字节的存储能力,结构为 128 x 8 x 2 (128个字节,每个字节8位,双组存储)。这种设计使得它能够在需要存储小型数据集,如配置数据、校准信息或设备状态等多种应用场景中良好运作。

接口与通讯

该器件使用 I²C 接口进行数据传输,支持多主机和多从机的系统架构。其最高时钟频率可达到 400kHz,确保快速数据交互和高效的系统性能。此外,I²C 通讯的硬件连接简单,能够减少 PCB 设计的复杂性,并降低引脚数量,这使得 24AA02UIDT-I/OT 适合于小型化申请。

低电压操作

24AA02UIDT-I/OT 的供电电压范围为 1.7V 至 5.5V,允许其在低功耗为主的设计环境中使用。这一范围不仅适应了多种电源方案,还为电池供电的应用提供了灵活性。例如,它可以用于可穿戴设备、便携式医疗仪器等需要长时间在低功耗状态下运行的产品。

工作温度

该 EEPROM 存储器的工作温度范围能够达到 -40°C 至 +85°C,符合工业级温度标准。这样高的工作温度范围使其不仅适用于普通消费类电子产品,还适合在严苛环境中工作的设备,如汽车电子、工业自动化设备和环境监测系统。

封装与安装类型

24AA02UIDT-I/OT 的引脚封装为 SOT-23-5,属于表面贴装型(SMD),方便在现代电路板上高效安装。这种小型化设计允许在空间有限的应用场合使用,同时也符合多层电路板设计的需求。

应用场景

凭借其典型的参数和特性,24AA02UIDT-I/OT 可广泛应用于各种典型的应用场景。例如:

  1. 工业自动化: 用于设备配置、传感器校准数据的存储,确保设备在不同运行模式下的持久性和可靠性。
  2. 消费电子: 可用于个人电子产品的设置参数、用户偏好数据的存储,随着设备功能的更新,能够持续保持用户信息。
  3. 汽车电子: 在车辆控制单元、信息娱乐系统中安全存储重要信息。
  4. 医疗设备: 存储设备的历史运行数据与病例信息,保证在断电后数据的安全性与完整性。

结论

综上所述,24AA02UIDT-I/OT 是一款极具实用价值和高性能的 EEPROM 存储器,凭借其卓越的技术参数和广泛的应用潜力,为设计工程师提供了一种可靠的解决方案。无论是用于新产品开发还是现有产品优化,24AA02UIDT-I/OT 都是值得推荐的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.