WMSIC Electronic Components

MICROCHIP SST26VF064BT-104I/SM SST26VF064BT

ModelSST26VF064BT-104I/SM
PackageSOIC-8-208mil
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP SST26VF064BT-104I / SM
Type
MICROCHIP
Minimum package
2100 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
SST26VF064BT-104I/SM
Electronic Component
1
Package
SOIC-8-208mil
Electronic Component
NOR FLASH
Electronic Component
0.18g
Electronic Component
1
Features
positions
Electronic Component
BM0230032051
Electronic Component
64Mbit
Operating Voltage
2.3V~3.6V
Current
15uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
104MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SST26VF064BT-104I/SM 产品概述

一、产品简介

SST26VF064BT-104I/SM 是由 Microchip(美国微芯)推出的一款 64Mbit(8M x 8)串行闪存(SPI NOR Flash),支持四线 Quad I/O 接口并可在最高 104MHz 时钟下工作。器件面向对容量、可靠性和读写性能有较高要求的嵌入式系统,封装为 SOIC-8(208 mil),适配工业级应用环境。

二、主要特性

  • 存储容量:64Mbit(8M x 8),适用于固件、配置数据及日志存储。
  • 接口类型:SPI,支持 Quad I/O 模式以提高读带宽。
  • 时钟频率:最高 104MHz,满足高速读取需求。
  • 工作电压:2.3V ~ 3.6V,支持常见 3.3V 系统及低压容错设计。
  • 页写入时间(Tpp):典型 1.5ms,写入延迟短。
  • 擦写寿命:100,000 次,适合频繁更新的场景。
  • 数据保持(TDR):100 年,保证长期数据可靠性。
  • 待机电流:典型 15 μA,适合低功耗待机设计。
  • 封装:SOIC-8-208mil,焊接和手板开发友好。

三、电气与性能参数(关键项)

  • 供电范围:2.3–3.6V,宽电压范围有利于多电源系统兼容。
  • 最高工作频率:104MHz,Quad I/O 在高频下可大幅提升读取效率。
  • 写/擦性能:页写入约 1.5ms,块/扇区擦写与擦写寿命(100k 次)结合,适合需要大量更新与可靠性的嵌入式应用。
  • 待机与功耗:待机电流仅 15 μA,有利于功耗敏感设备的电池寿命管理。

四、典型应用场景

  • 工业控制器固件存储与升级(支持长期数据保存与高可靠写入)
  • 网络设备与通信终端的配置与引导存储(高速启动、快速读取)
  • 消费电子与物联网终端的固件、日志与参数存储(低功耗待机)
  • 汽车电子(在满足温度与可靠性需求下)及其他嵌入式系统

五、设计与选型建议

  • 信号完整性:104MHz 工作频率下,注意 SPI 总线走线、阻抗匹配与去耦电容布局,避免反射与串扰。
  • 电源去耦:在器件 VCC 附近放置 0.1μF 与 1μF 去耦电容,确保写操作和高频读操作时的电源稳定。
  • 写入策略:结合页写入时间与擦写寿命,建议对频繁更新的数据采用擦写/写入合批、 wear leveling(若为文件系统)或环形缓冲策略以延长寿命。
  • 地址空间:64Mbit = 8MB,可在标准 3 字节地址空间内寻址(无须强制 4 字节寻址),但设计时仍需确认主控的地址处理机制。
  • 兼容性:器件兼容常见 SPI/Quad 命令集,选择 MCU/主控时确认对 Quad I/O 命令与 104MHz 工作频率的支持。

六、封装与可靠性

  • 封装形式:SOIC-8-208mil,利于量产与手工焊接开发板使用。
  • 可靠性:Microchip 品牌背景与器件的高数据保持(100 年)与高擦写耐久(100k 次)共同保证长期可靠性,适合对数据保存与设备寿命有严格要求的产品。

综上,SST26VF064BT-104I/SM 在容量、速度、耐久与低功耗之间实现了良好平衡,适用于多类嵌入式与工业应用。选择时请综合系统电源、主控兼容性与写入策略,以发挥该器件在性能与可靠性方面的优势。

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