WMSIC Electronic Components

MICROCHIP MIC38HC43YM-TR MIC38HC43YM

ModelMIC38HC43YM-TR
PackageSOIC-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MIC38HC43YM-TR
Type
MICROCHIP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MIC38HC43YM-TR
Electronic Component
1
Package
SOIC-8
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.109g
Electronic Component
1
Features
(UVP)
Electronic Component
BM0259369643
Electronic Component
PWM
Operating Temperature
40℃~+85℃
Operating Voltage
7.6V~20V
Switching Frequency
49kHz~55kHz
Output Voltage
4.9V~5.1V
Electronic Component
96%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MIC38HC43YM-TR 产品概述

一、产品概述

MIC38HC43YM-TR 是美国微芯(Microchip)面向多种开关电源拓扑的开关控制器IC,封装为 SOIC-8。器件以 PWM 调制为工作模式,可应用于升压、降压、反激(隔离)和正激(隔离)等拓扑,适合需稳定 5V 输出并兼顾隔离与非隔离设计的中低功率 DC-DC 转换器。器件设计注重系统灵活性与可靠性,便于在汽车电子、工业控制、通信电源及消费类电子等领域集成使用。

二、主要技术规格

  • 工作电压:7.6V ~ 20V
  • 开关频率范围:49kHz ~ 55kHz(可用于固定或微调频率方案)
  • 最大占空比:96%(适合低压差大升压/降压比场景)
  • 输出标称电压:4.9V ~ 5.1V(用于提供稳健的 5V 供电)
  • 工作温度:-40℃ ~ +85℃
  • 工作模式:PWM 调制
  • 封装:SOIC-8(适配标准 PCB 布局与散热设计)

三、功能特性

  • 支持多种拓扑:升压、降压、反激、正激,能覆盖隔离与非隔离系统设计需求。
  • 欠压锁定与欠压保护(UVP):在输入电压低于设定阈值时保护系统,保障器件与负载安全。
  • 高占空比支持:最大可达 96%,利于在低输入电压或高增益转换要求下维持输出。
  • 稳定的开关频率:49–55kHz 范围,便于滤波器与磁性元件规格化设计。
  • SOIC-8 封装利于量产装配与热管理。

四、典型应用场景

  • 需隔离的反激/正激小功率电源(例如工业控制、仪表隔离电源)
  • 非隔离的升压/降压稳压模块(例如便携设备、通信终端)
  • 车载辅助电源与总线供电(在允许的输入电压范围内使用)
  • 通用 5V 电源模块与参考电源系统

五、设计建议与注意事项

  • 拓扑选择:反激/正激用于需要隔离的场合,降压/升压用于非隔离、高效率要求的场合。
  • 外部器件:根据输出电流与效率目标选择合适的开关器件、磁性元件与输出滤波器;高占空比工况下注意开关器件的持续导通损耗。
  • 环路补偿:采用 PWM 控制时,稳定的误差放大与补偿网络对系统动态性能与输出精度至关重要。
  • 散热与布局:SOIC-8 封装需注意 PCB 铜箔散热与关键布线(电流回路、功率地与信号地分离),以避免寄生与 EMI 问题。
  • 保护策略:结合器件内置的欠压保护并在系统层面考虑过流、过温保护以提升可靠性。

六、封装与可靠性

MIC38HC43YM-TR 提供标准 SOIC-8 包装,适合自动贴装流程。工作温度覆盖工业级范围(-40℃ ~ +85℃),可满足一般工业与消费类环境下的长期可靠性需求。设计时建议参考厂商应用笔记与参考设计,以获得最佳 EMI、效率与热性能表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.