Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICROCHIP MCP130T-315I/TT MCP130T
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICROCHIP MCP130T-315I / TT
- Type
- MICROCHIP
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MICROCHIP
- Electronic Component
- MCP130T-315I/TT
- Electronic Component
- 1
- Package
- SOT-23-3
- Electronic Component
- Supervisorand positions IC
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Electronic Component
- BM0094330956
- Reset
- 350ms
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1V~5.5V
- ICType
- Voltage Supervisor
- Output Type
- Electronic Component
- Voltage
- 3V
- Static Current(Iq)
- 45uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCP130T-315I/TT 产品概述
一、产品简介
MCP130T-315I/TT是由美国微芯（Microchip Technology Inc.）制造的一款高度集成的电压监控和复位芯片，具有出色的性能和可靠性。该芯片采用SOT-23-3封装，适合表面贴装，广泛应用于各类电子设计中，尤其是对电源管理和系统可靠性要求较高的领域。
二、主要特点
监控功能：MCP130T-315I/TT具备单一监控电压，能够实时监测供电电压，并在电压低于设定阈值（3.075V）时，生成复位信号，从而保护后续电路免受电源电压不稳定带来的影响。
复位功能：该芯片实现了低有效的复位信号输出，采用开路漏极（或开路集电极）的配置，使其能够与多种负载相连接，增强了设计的灵活性。复位超时周期设置为最少150毫秒，确保系统在电源恢复时有足够的时间进行稳定。
温度范围：MCP130T-315I/TT的工作温度范围为-40°C至85°C，使其在各种恶劣环境下仍能保持稳定的性能，满足工业、汽车及消费类电子产品的需求。
复位模式：该芯片支持简单复位和加电复位功能，用户可根据实际应用需求选择适合的复位类型。这一特性为电源管理电路及系统初始化过程提供了便利。
三、应用场景
MCP130T-315I/TT芯片广泛应用于许多需要电压监控与复位操作的领域，具体包括但不限于：
- 嵌入式系统：在微控制器和数字信号处理器（DSP）应用中，确保在电源恢复后设备正常启动和运行。
- 汽车电子：为汽车控制单元提供稳定的复位信号，确保车辆的安全和功能正常。
- 工业自动化：用于监测电源电压，保护工业控制系统和设备免受电源波动的影响。
- 消费电子：如家用电器和便携式设备，以确保设备在电源电压不稳定时不会损坏。
四、封装和设计考虑
MCP130T-315I/TT采用SOT-23-3封装，符合现代电子设计对空间及重量的严格要求。该封装允许简化的布局与焊接，从而降低生产成本和提高制造效率，同时优化了整体设备的性能。
在设计电路时，用户应注意以下几点：
- 电源电压区间：确保输入电压在芯片规格范围内，以避免对芯片造成损坏。
- 外部组件选择：复位信号的缓冲和延迟可通过外接电容和电阻来实现，设计师可根据需要调整这些值，以实现最佳的复位时序。
- PCB布局：优先考虑电源和地线的布置，确保稳定的工作环境。
五、总结
MCP130T-315I/TT是一款功能强大且应用广泛的电压监控和复位芯片，凭借其可靠的性能和温度适应性，在各种电子产品中扮演着至关重要的角色。无论是在汽车、工业还是消费电子领域，MCP130T-315I/TT都可有效提高系统的安全性和稳定性，是电源管理和监控设计的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
