WMSIC Electronic Components

MICROCHIP MCP6022T-E/ST MCP6022T

ModelMCP6022T-E/ST
PackageTSSOP-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MCP6022T-E / ST
Type
MICROCHIP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP6022T-E/ST
Electronic Component
1
Package
TSSOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.199g
Electronic Component
1
Electronic Component
Output
Features
Built-in; ESD
Electronic Component
BM0169023273
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
30mA
(SR)
7V/us
Power Supply Voltage
2.5V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP6022T-E/ST 产品概述

MCP6022T-E/ST是一款高性能的双路运算放大器,采用表面贴装型封装(TSSOP-8),特别设计用于各种模拟信号处理应用。其额定工作温度范围为-40°C至125°C,确保其在苛刻环境下的稳定性和可靠性。该器件属于MICROCHIP(美国微芯)产品系列,以其卓越的性能特征和广泛的应用适用性受到工程师和设计师的青睐。

主要参数

  1. 电路数: MCP6022T-E/ST具备两个独立的运算放大器,能够同时处理多个信号通道,为设计提供了灵活性和便利性。

  2. 安装类型: 采用表面贴装技术(SMD),适合自动化生产,节省PCB空间,满足高密度布线要求。

  3. 压摆率: 该器件具有高达7V/µs的压摆率,使其能够快速响应变化的输入信号,非常适合高频和快速信号处理应用。

  4. 工作温度范围: 其工作温度范围为-40°C至125°C,适合应用于汽车、工业和其他对温度敏感的环境。

  5. 输出类型: MCP6022T-E/ST提供满摆幅输出,使其可以接近供电电压的极限,从而增强信号的传输质量。

  6. 增益带宽积: 具有10MHz的增益带宽积,适合高频应用,确保信号的线性处理。

  7. 电流供电: 器件在运行时的供电电流仅为2mA,确保低功耗操作,适合电池供电和便携式设备的使用。

  8. 电压供电: MCP6022T-E/ST允许单/双极供电,电压范围为2.5V至5.5V,为设计人员提供了更大的电源选择灵活性。

  9. 电流输出能力: 每个通道的输出电流可达30mA,充分满足了多种负载要求。

  10. 偏置电流与输入补偿: 其输入偏置电流仅为1pA,输入补偿电压为500µV,这些特性使其在精密测量和传感器应用中表现出色。

应用场景

MCP6022T-E/ST运算放大器广泛应用于多种电子设备中,以下是一些典型应用场景:

  • 传感器信号放大: 可用于放大来自传感器的微弱信号,确保信号强度足以进行ADC转换或后级处理。
  • 音频处理: 由于其优秀的带宽和低失真性能,适用于音频处理和信号调理电路。
  • 数据采集系统: 适合用于高精度数据采集系统中,能够保证信号的有效处理和传输。
  • 医疗设备: 由于其低功耗和宽温度范围,适合用于便携医疗设备及监测设备。
  • 工业控制: 可应用于各种工业自动化和控制系统中,用于高速信号处理及控制反馈。

总结

MCP6022T-E/ST作为一款高性能的双路运算放大器,其小封装设计、低功耗特性和优越的电气性能使其成为各种应用的理想选择。无论是在汽车、通信、医疗还是工业设备中,MCP6022T-E/ST都展现了其高度的适应性和可靠性。凭借MICROCHIP的技术支持和丰富的产品系列,MCP6022T-E/ST为电子设计师提供了值得信赖的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.