Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCP6022T-E/ST是一款高性能的双路运算放大器,采用表面贴装型封装(TSSOP-8),特别设计用于各种模拟信号处理应用。其额定工作温度范围为-40°C至125°C,确保其在苛刻环境下的稳定性和可靠性。该器件属于MICROCHIP(美国微芯)产品系列,以其卓越的性能特征和广泛的应用适用性受到工程师和设计师的青睐。
电路数: MCP6022T-E/ST具备两个独立的运算放大器,能够同时处理多个信号通道,为设计提供了灵活性和便利性。
安装类型: 采用表面贴装技术(SMD),适合自动化生产,节省PCB空间,满足高密度布线要求。
压摆率: 该器件具有高达7V/µs的压摆率,使其能够快速响应变化的输入信号,非常适合高频和快速信号处理应用。
工作温度范围: 其工作温度范围为-40°C至125°C,适合应用于汽车、工业和其他对温度敏感的环境。
输出类型: MCP6022T-E/ST提供满摆幅输出,使其可以接近供电电压的极限,从而增强信号的传输质量。
增益带宽积: 具有10MHz的增益带宽积,适合高频应用,确保信号的线性处理。
电流供电: 器件在运行时的供电电流仅为2mA,确保低功耗操作,适合电池供电和便携式设备的使用。
电压供电: MCP6022T-E/ST允许单/双极供电,电压范围为2.5V至5.5V,为设计人员提供了更大的电源选择灵活性。
电流输出能力: 每个通道的输出电流可达30mA,充分满足了多种负载要求。
偏置电流与输入补偿: 其输入偏置电流仅为1pA,输入补偿电压为500µV,这些特性使其在精密测量和传感器应用中表现出色。
MCP6022T-E/ST运算放大器广泛应用于多种电子设备中,以下是一些典型应用场景:
MCP6022T-E/ST作为一款高性能的双路运算放大器,其小封装设计、低功耗特性和优越的电气性能使其成为各种应用的理想选择。无论是在汽车、通信、医疗还是工业设备中,MCP6022T-E/ST都展现了其高度的适应性和可靠性。凭借MICROCHIP的技术支持和丰富的产品系列,MCP6022T-E/ST为电子设计师提供了值得信赖的解决方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products