WMSIC Electronic Components

MICROCHIP MCP9600-E/MX MCP9600

ModelMCP9600-E/MX
PackageQFN-20-EP(5x5)
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MCP9600-E / MX
Type
MICROCHIP
Minimum package
73 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP9600-E/MX
Electronic Component
1
Package
QFN-20-EP(5x5)
Electronic Component
ADC / DAC - Special Purpose
Electronic Component
1.2g
Electronic Component
1
Channel Count
4
Features
Programmable
Electronic Component
BM0228537213
Operating Temperature
40℃~+125℃
Operating Voltage
2.7V~5.5V
Interface Type
I2C
Data
100kHz
ICType
Converter

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP9600-E/MX 产品概述

一、产品简介

MCP9600-E/MX 是美国微芯(Microchip)推出的一款热电偶数字转换器,面向多通道、高精度温度测量应用。器件将热电偶产生的微弱热电势直接转换为数字温度值,通过标准 I2C 总线输出,便于 MCU 或其它主控设备读取与集成。该芯片适用于要求小体积、低功耗与工业级温度范围的测量场景。

二、主要规格

  • 分辨率:18 位
  • 通道数:4 路热电偶输入
  • 工作电压:2.7 V ~ 5.5 V(单电源供电)
  • 接口类型:I2C(标准模式 100 kHz)
  • 芯片类型:热电偶数字转换器
  • 工作温度:-40 ℃ ~ +125 ℃
  • 静态电流:典型 300 μA
  • 封装:QFN-20-EP(5 x 5 mm)
  • 品牌:MICROCHIP(美国微芯)

三、产品优势

  • 高分辨率(18 位)能够提高温度检测的细微分辨能力,适合对精度有较高要求的场合。
  • 四通道输入便于一颗芯片同时采集多点温度,节省 PCB 面积和系统成本。
  • 宽工作电压范围(2.7–5.5 V)兼容多种微控制器与电源方案。
  • 低静态电流(≈300 μA)利于电池供电或低功耗系统应用。
  • 标准 I2C 接口(100 kHz)实现与主控器通信的简便性与互操作性。
  • 工业级工作温度覆盖常见严苛环境(-40~125 ℃)。

四、典型应用

  • 工业温控与过程监测
  • 电池组与动力系统温度管理
  • HVAC(暖通空调)与家庭电器温度测量
  • 实验室仪器与数据采集系统
  • 汽车座舱与电机温度监测(需评估符合车规要求)

五、设计与使用建议

  • 布局:热电偶信号为低幅度微伏级,布局时应尽量缩短热电偶输入走线并避免数字线干扰,采用差分走线或屏蔽以减少噪声。
  • 去耦与滤波:电源端做好去耦(靠近芯片放置陶瓷电容),可在热电偶输入端加小信号滤波以抑制高频干扰。
  • I2C 总线:为保证通信可靠性,根据系统需要配置上拉电阻;多器件并联时注意地址管理与总线拓扑。
  • 冷端补偿与线性化:此类器件通常集成冷端补偿与线性化功能,建议按数据手册配置测量参数与寄存器以获得最佳精度。
  • 误差评估:在系统级验证时考虑热电偶类型、连接接点材质及温差引入误差,必要时做校准与误差补偿。

六、封装与环境

MCP9600-E/MX 使用 QFN-20-EP(5×5 mm)封装,利于紧凑型布局与良好散热。器件支持工业级温度范围,适合在较苛刻环境中长期工作。建议查阅 Microchip 官方数据手册以获取引脚定义、寄存器映射、热特性及典型应用电路,确保在实际设计中满足所有电气与热性能要求。

如需进一步资料(引脚图、寄存器说明、参考电路或热电偶类型支持列表),可提供具体需求,我将基于官方数据手册给出更详尽的建议。

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