WMSIC Electronic Components

MICROCHIP PIC16F877A-I/PT PIC16F877A

ModelPIC16F877A-I/PT
PackageTQFP-44(10x10)
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP PIC16F877A-I / PT
Type
MICROCHIP
Unit
Electronic Component
Minimum package
1600 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
PIC16F877A-I/PT
Electronic Component
1
Package
TQFP-44(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.499g
CPU
8 Bit
CPU
PIC
I / O
33
RAM
368Byte
Electronic Component
1
ADC
10bit
EEPROM
256Byte
Features
(BOR / LVD / LVR / LVI); positions(POR); Built-in General Purpose; Gate positions

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:PIC16F877A-I/PT

1. 概述

PIC16F877A-I/PT是一款由美国微芯科技(Microchip Technology Inc.)出品的8位单片机。它基于微芯的PIC架构,专为各种嵌入式应用设计,以提供灵活性、可靠性和良好的性能。该单片机采用44-TQFP封装,适用于空间受限的应用,带有多种强大的外设,适合用于工业控制、家电、汽车电子和物联网(IoT)等领域。

2. 基础参数

  • CPU架构:8位
  • 最大主频:20MHz
  • ROM类型:闪存,程序存储容量为14KB(8K x 14)
  • RAM大小:368字节
  • EEPROM容量:256字节
  • 工作电压:4V ~ 5.5V
  • 工作温度范围:-40°C ~ 85°C
  • 封装类型:44-TQFP(10x10mm)
  • I/O引脚:共33个

3. 外设和接口

PIC16F877A-I/PT拥有丰富的接口和外设,支持多种通信协议,具体如下:

  • 串行通信:

    • UART/USART:1个通道,支持异步串行通信,方便与其他设备(如传感器、模块等)进行数据交换。
    • SPI:1个通道,支持高速同步串行通信,适用于存储器和传感器等设备的连接。
    • I2C(SMBUS/PMBUS):1个通道,支持多主机和多从机的数据传输,适合于复杂的设备网络。
  • 模拟功能:

    • A/D转换器:内置8个10位的模拟到数字转换通道,能够处理多个模拟信号输入,支持传感器和测量应用。
  • PWM输出:支持2个PWM输出通道,适合于电机控制、亮度调节和音频应用等需要调制信号的场景。

  • 其他外设:

    • 欠压检测和复位功能(POR)确保在电源不稳定时能保持系统安全。
    • 看门狗定时器(WDT)提高系统的可靠性,防止程序出现死循环或崩溃。

4. 应用场景

PIC16F877A-I/PT广泛应用于各种嵌入式系统,包括但不限于:

  • 工业自动化:用于控制传感器、执行器和人机界面(HMI)设备。
  • 家用电器:在洗衣机、冰箱和空调等电器中用于实现智能控制和自动化。
  • 汽车电子:作为车载控制单元,监测和管理车辆的各种子系统。
  • 物联网:在智能家居和智能城市项目中用于数据采集和远程监控。

5. 设计考虑

在使用PIC16F877A-I/PT的设计中,开发人员需要考虑以下因素:

  • 电源管理:确保电源在4V到5.5V之间稳定,以保证单片机的正常工作。
  • 环境适应性:选择合适的材料和设计以适应-40°C到85°C的工作环境。
  • 资源分配:合理分配系统的I/O引脚和外设资源,以便满足具体应用的需求。

6. 总结

PIC16F877A-I/PT以其强大的功能、易于使用的特点和良好的性价比,在众多应用中表现突出。无论是需要丰富通信接口还是强大的数据处理能力,它都能提供相应的支持,使其成为设计各种电子设备的理想选择。利用该单片机,开发人员可以快速有效地实现高性能、低功耗的嵌入式解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.