WMSIC Electronic Components

MICROCHIP ATTINY13A-SSUR ATTINY13A

MICROCHIP ATTINY13A-SSUR ATTINY13A
1 / 3

Product image

ModelATTINY13A-SSUR
PackageSOIC-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP ATTINY13A-SSUR
Type
MICROCHIP
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
ATTINY13A-SSUR
Electronic Component
1
Package
SOIC-8
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.169g
CPU
8 Bit
CPU
AVR
I / O
6
RAM
64Byte
Electronic Component
1
ADC
10bit
EEPROM
64Byte
Features
(BOR / LVD / LVR / LVI); positions(POR); Gate positions; Programmable Gate; positions(NRST)

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：ATTINY13A-SSUR

ATTINY13A-SSUR 是由美国微芯科技（Microchip Technology Inc.）推出的一款高性能、低功耗的8位微控制器，该产品以其灵活的工作电压范围和丰富的功能选项，适用于各种低功耗嵌入式应用场景。作为一个高度集成的单片微控制器，ATTINY13A-SSUR 主要特性包括内置的闪存存储器、随机存储器（RAM）和电可擦除可编程只读存储器（EEPROM），使得其在资源受限的环境中表现出色。

关键特性

  1. CPU 和存储器：

    • ATTINY13A-SSUR 采用AVR架构，支持高达20MHz的主频，提供了良好的执行效率。
    • 它的程序存储容量为1KB，配合64字节的RAM和64字节的EEPROM，能够支持复杂的控制和数据处理任务。

  2. 工作电压范围：

    • 该微控制器支持1.8V至5.5V的广泛电压范围，适应不同的供电需求，特别利于便携式和电池供电设备。

  3. 输入/输出接口：

    • ATTINY13A-SSUR 具有6个可编程I/O引脚，用户可以灵活配置这些引脚作为输入或输出，适合多种传感器和执行器的连接需求。

  4. 模拟特性：

    • 其内置的4个10位模数转换器（A/D转换器）可用于读取模拟信号，广泛应用于数据采集和实时监控系统。

  5. 数字信号处理：

    • 该型号配备了2个PWM输出通道，能够实现精确的信号调制，常用于电机控制、LED调光等应用。

  6. 外设和保护功能：

    • ATTINY13A-SSUR 包含欠压检测（Brown-Out Reset），能够在供电电压低于设定阈值时自动复位，从而保护系统的正常运行。

  7. 温度范围：

    • 工作温度范围广泛，从-40°C到85°C的温度变化下，该器件仍然保持可靠的性能，非常适合工业和汽车应用。

  8. 封装：

    • 该微控制器采用小型的8-SOIC封装，表面贴装型设计方便集成于各种电路板，节省空间并简化生产流程。

应用场景

ATTINY13A-SSUR广泛应用于低功耗嵌入式系统，例如：

  • 消费电子产品：如遥控器、玩具、便携式设备等。
  • 工业控制：用于传感器数据采集、简单的自动化系统和电机控制。
  • 照明控制：智能LED照明设备的PWM调光。
  • 传感器接口：监测环境变化的数据采集系统。
  • 电池供电设备：由于其低功耗运行特性，极其适合电池驱动应用。

总结

ATTINY13A-SSUR以其高性能、灵活性和多功能性，成为了低功耗嵌入式应用中一种理想的单片机解决方案。由于其适应广泛的工作电压范围、丰富的外围功能和小巧的封装设计，该产品可满足各种创新设计的需求。Microchip通过提供强大的开发工具和支持，帮助工程师以更低的开发成本和时间将其设计推向市场，为其创造更多的商业机会。无论是业余爱好者还是专业开发人员，ATTINY13A-SSUR都能成为他们在微控制器设计中的得力助手。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.