WMSIC Electronic Components

MICROCHIP DN2540N8-G DN2540N8

ModelDN2540N8-G
PackageSOT-89
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP DN2540N8-G
Type
MICROCHIP
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
DN2540N8-G
Electronic Component
1
Package
SOT-89
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.085g
Electronic Component
1
Electronic Component
BM69419390
Power Dissipation(Pd)
1.6W
Gate Voltage(Vgs)
±20V
Electronic Component
Electronic Component
Electronic Component
2000
Voltage(Vdss)
400V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DN2540N8-G 产品概述

概述

DN2540N8-G是一款由美国微芯科技(Microchip Technology Inc.)生产的高性能N沟道MOSFET(场效应管),其具有400V的漏源电压能力,使其能够在高压环境下可靠地工作。这款器件广泛应用于电源管理、开关电路、灯光调节等各种要求高效开关操作的应用场景。

关键参数

  • 类型: N沟道MOSFET
  • 漏源电压 (Vdss): 400V
  • 连续漏极电流 (Id): 170mA (在25°C时,Tj=25°C)
  • 导通电阻 (Rds(on)): 在120mA时最大值为25Ω
  • 驱动电压 (Vgs): 最大值为±20V
  • 输入电容 (Ciss): 在25V下最大值为300pF
  • 功率耗散 (Pd): 最大值为1.6W (在Tc时)
  • 工作温度范围: -55°C到150°C
  • 封装类型: 表面贴装型 (SMD)
  • 器件封装: TO-243AA (SOT-89)

设计特性

DN2540N8-G的设计特点使其在高压应用中表现出色。其具有较高的漏源电压(Vdss),能够承受高达400V的工作电压,使其非常适合用于高压电源模块和电机驱动器。虽然其连续漏极电流为170mA,但该器件在设计时保证了在额定条件下的稳定性与可靠性。

此外,它的高工作温度范围(-55°C ~ 150°C)使其适用于严苛的环境,能够在多种工业应用中可靠运行。DN2540N8-G还具备耗尽模式功能,这意味着在无栅极电压的情况下,通道可以保持关闭状态,提高了系统在无驱动情况下的安全性。

驱动和控制

该MOSFET的最大驱动电压(Vgs)为±20V,意味着它可以通过适当的栅极驱动信号来实现快速开关操作,从而提高整个电路的工作效率。 其最大导通电阻为25Ω(在120mA下),在实际应用中,这一特性保证了较低的功耗,减少了发热,并提高了系统的整体性能。

封装和安装

封装方面,DN2540N8-G采用TO-243AA(SOT-89)封装,具有小尺寸和低重量的特性,使其方便在密集的电路板上安装。这种表面贴装型设计可以大大提高PCB的空间利用效率,并简化自动化焊接过程。因此,该器件非常适合用于多种现代电子产品和设备中,如便携式设备、工业控制、汽车电子等。

应用场合

DN2540N8-G广泛应用于各种电源管理及控制系统,包括但不限于以下领域:

  • 开关电源:用于电源变换器中,可以增加效率并减少损耗。
  • 电机驱动:在电机控制器中作为开关管,用于调节电机速度。
  • LED驱动电路:在LED照明系统中,可以有效控制LED的亮度。
  • 高压继电器:可以作为高压开关,用于控制大功率负载。

结论

通过结合高耐压、低导通电阻以及广泛工作温度范围等特性,DN2540N8-G在高压开关和控制应用中展示了其卓越的性能,是工程师在设计电源管理系统时值得考虑的理想选择。微芯科技凭借其在电子元器件领域的专业性,为DN2540N8-G的出色表现提供了充分的保证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.