Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
24AA024-I/SN 是 Microchip(美国微芯)推出的一款工业级串行 EEPROM,容量 2Kbit(2048 位 = 256 字节),采用标准 I2C 两线接口,工作电压范围宽(1.7V ~ 5.5V),工作温度范围 -40℃ 到 +85℃,并以 SOIC-8 封装提供。器件面向存储少量非易失性数据的嵌入式系统设计,适用于系统配置、校准参数、序列号与少量日志等场景。
该器件支持广泛电压范围(1.7V 至 5.5V),使其可在单节锂电池、3.3V 与 5V 系统中直接使用。在 I2C 总线速率方面,支持高达 400 kHz 的时钟频率,满足大多数嵌入式控制器对快速配置和读取的需求。器件的工业温度等级(-40℃ 到 +85℃)使其适合车载外围、工业自动化与室外设备等较严苛环境。
24AA024-I/SN 提供 2Kbit 的非易失性存储容量,适合保存系统配置字、校准参数、制造信息或小容量日志。器件写入耐久度高达 1,000,000 次,适合需要频繁改写的应用。厂商给出的数据保持时间(TDR)达 200 年,显示在正常使用条件下数据保持性优良。实际系统设计中,应参考应用写入频率与数据保持要求来评估寿命与维护策略。
器件通过标准 I2C 两线接口进行访问,SDA 与 SCL 信号与通用微控制器直接连接即可。典型写周期(内部写入完成时间)为 5 ms,写操作完成前请确保不切断电源或进行新的写请求,以免写入失败或存储损坏。采用页面写操作可提高总线效率(具体页面大小与写入模式请参见 Microchip 官方数据手册)。
产品以 SOIC-8 封装提供,适配通用 DIP/SOIC 的贴片工艺与现成的 PCB Footprint。SOIC-8 封装利于自动贴片与回流焊接,便于量产。更多封装尺寸与焊盘建议请参照厂商机械规格说明。
该器件型号为 24AA024-I/SN,前缀/后缀含义(如 I:工业等级、/SN:包装信息)及可选封装或 Tape & Reel 形式请参考 Microchip 官方产品页面与数据手册或咨询当地代理商以获取最新供货与封装信息。
总结:24AA024-I/SN 提供了小容量、低电压宽范围、工业级温度与高耐久性的非易失存储解决方案。其标准 I2C 接口和 SOIC-8 封装使其易于在现有硬件平台中集成,用于保存关键但体积小的配置信息与数据。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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