WMSIC Electronic Components

MICROCHIP PIC16F73-I/SP PIC16F73

ModelPIC16F73-I/SP
PackageDIP-28-300mil
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP PIC16F73-I / SP
Type
MICROCHIP
Unit
Electronic Component
Minimum package
15 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
PIC16F73-I/SP
Electronic Component
1
Package
DIP-28-300mil
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
3.643g
CPU
8 Bit
CPU
PIC
I / O
22
RAM
192Byte
Electronic Component
1
ADC
8bit
Features
(BOR / LVD / LVR / LVI); positions(POR); Gate positions; Built-in General Purpose; positions(NRST)
Electronic Component
BM0229945402

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PIC16F73-I/SP 产品概述

一、功能概述

PIC16F73-I/SP 是美国 MICROCHIP(微芯)推出的一款 8 位单片机,采用 PIC 内核、外置振荡器工作,面向中低功耗与成本敏感的嵌入式控制应用。器件提供丰富的通用 I/O 资源与片内 FLASH 程序存储,适合小型控制、传感采集和人机界面等场景。

二、主要规格

  • CPU 位数:8 bit(PIC 内核)
  • 程序存储:7 KB FLASH
  • RAM 容量:192 Byte
  • I/O 数量:22 路通用 I/O
  • ADC:8 bit 分辨率模数转换器
  • 最大主频:20 MHz(外置晶振)
  • 工作电压:4.0 V ~ 5.5 V
  • 工作温度:-40 ℃ ~ +85 ℃(工业级)
  • 封装:DIP-28-300mil(便于面包板与手工焊接)
  • 品牌:MICROCHIP(美国微芯)

三、性能亮点

  • 片上 FLASH 存储器支持现场升级与多次编程,便于固件维护与功能迭代。
  • 22 路通用 I/O 可满足多通道开关、指示灯、按键以及外设控制的需求,使用 DIP-28 封装方便快速验证与开发。
  • 集成 8 位 ADC,适合对温度、光照、压力等模拟量进行快速采样与处理。
  • 广泛的工作温度范围和 4.0–5.5 V 供电适合工业与车载边缘应用(应按系统要求验证)。
  • 与 MICROCHIP 的开发生态兼容,可使用 MPLAB IDE、XC 编译器及常见的 PIC 编程器/调试器(如 PICkit)进行开发与调试。

四、典型应用场景

  • 工业控制:小型 PLC、传感器数据采集、逻辑控制单元。
  • 仪表仪器:面板按键扫描、LED 驱动、模拟量读取与显示控制。
  • 消费类电子:简单家电控制、玩具与教育开发板。
  • 原型验证与教学:DIP-28 封装便于面包板搭建与课堂演示。

五、设计与使用建议

  • 电源管理:在 VDD 附近放置 0.1 µF 陶瓷去耦,靠近芯片引脚;对噪声敏感系统可增加滤波与稳压。
  • 振荡器选择:根据系统时序与 EMI 要求选择合适的外置晶振或谐振器,并按照数据手册布置负载电容。
  • I/O 与模拟接口:模拟输入若接传感器,应做抗干扰和阻抗匹配;数字输入建议使用上拉/下拉电阻以避免浮空。
  • 编程与调试:预留 ICSP 接口,便于在目标板上进行在线编程与调试。
  • 可靠性:工作在极限温度或电压条件下时,应进行系统级测试与验证,必要时加入看门狗、上电复位和电源监测等保护措施。

总结:PIC16F73-I/SP 以其适中的资源配置、工业级温度范围和 DIP-28 友好封装,适合对成本、可靠性和易用性有要求的嵌入式项目。建议在设计前参考 MICROCHIP 官方数据手册以获取完整引脚、时序和电气规范。

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