Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCP6561T-E/LT 是由美国微芯科技(Microchip Technology Inc.)制造的一款高性能比较器,广泛应用于各种电子系统中。其设计旨在满足日益增长的市场对小型、高效率且性能稳定的模拟元器件的需求。下面将从特性、应用场景及优点等方面对该产品进行详细介绍。
类型和输出:MCP6561T-E/LT 是一款通用的比较器,采用推挽式输出,具备满摆幅的输出能力,且兼容 TTL 逻辑电平,适用性广泛。
供电电压范围:该产品支持 1.8V 至 5.5V 的单电源供电,极大地方便了在不同系统中的应用。同时,其在低电压下的良好表现,使其适用于移动设备及便携式电子产品。
输入特性:MCP6561T-E/LT 的输入补偿最大值为 10mV(在供电5.5V时),同时输入偏置电流极低,仅为 1pA,这一特性使得它在高阻抗输出的应用中也具备极高的精度。
输出能力:该比较器在典型情况下可以提供 50mA 的输出电流,能够驱动多种负载,而静态电流的最大值仅为 130μA,意味着在待机状态下非常节能。
性能指标:MCP6561T-E/LT 的共模抑制比(CMRR)和电源抑制比(PSRR)分别达到了 66dB 和 70dB,确保在不同工作条件下,信号处理的稳定性和准确性。此外,其传播延迟最大值为 80ns,适应了快速响应的应用需求。
滞后特性:滞后值为 5mV,有利于提高系统的抗干扰能力,避免在噪声环境下出现误触发。
工作环境:该产品的工作温度范围为 -40°C 到 +125°C,适合多种严苛的工业和环境条件。
封装形式:MCP6561T-E/LT 提供 SC-70-5 封装,适合表面贴装,体积小且设计灵活,便于在空间有限的电路板上实行密集布局。
MCP6561T-E/LT 适合应用于不同领域的各种电子系统,主要应用场景包括:
移动电子设备:如智能手机、平板电脑等,由于其低电压工作和小型封装特点,理想于电池供电的设备。
工业自动化:作为传感器接口或者信号处理单元,MCP6561T-E/LT 的高可靠性和耐环境性能使其能够很好地适应工业环境。
消费电子产品:在家用电器、音响系统等消费类产品中,能够用于电平监控与信号比较。
医疗设备:其高精度和低功耗特点也使其适用于便携式医疗监测设备。
高精度和低功耗:极低的输入偏置电流和静态电流使得 MCP6561T-E/LT 成为高精度和高效能的选择,有效延长电池寿命。
灵活的供电与工作环境:宽广的供电电压范围和广泛的工作温度区间,使其在多种不同的系统中都能稳定运行。
集成度高:小型 SC-70-5 封装充分节省了空间,特别适合高密度电路布局。
优秀的抗干扰性能:较高的 CMRR 和 PSRR,配合适当的滞后特性,确保了在各种环境条件下的信号准确性。
总之,MCP6561T-E/LT 是一款在性能、功耗和适用性方面都极具竞争力的比较器,能够满足市场对高质量电子元器件的需求,是现代电子设计中不可或缺的组成部分。无论是在工业、消费电子还是医疗设备领域,这款比较器都能发挥出色的表现。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products