WMSIC Electronic Components

MICROCHIP PIC16LF1516-I/SO PIC16LF1516

ModelPIC16LF1516-I/SO
Package28-SOIC
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP PIC16LF1516-I / SO
Type
MICROCHIP
Unit
Electronic Component
Minimum package
1000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
PIC16LF1516-I/SO
Electronic Component
1
Package
28-SOIC
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.04g
CPU
8 Bit
CPU
PIC
I / O
25
RAM
512Byte
Electronic Component
1
ADC
10bit
Features
(BOR / LVD / LVR / LVI); Gate positions; positions(POR); positions; positions; Built-in General Purpose
Electronic Component
BM0259466331

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PIC16LF1516-I/SO 产品概述

一、产品简介

PIC16LF1516-I/SO 是 Microchip(美国微芯)推出的一款低压、低功耗 8 位单片机,采用 PIC 内核,最高主频 20 MHz。器件集成度高,适合对尺寸、功耗和成本有严格要求的嵌入式控制应用。器件程序存储器为 14 KB FLASH,RAM 为 512 Byte,提供灵活的系统设计能力。

二、主要特性

  • CPU:PIC 8-bit 内核,最高 20 MHz。
  • 存储:14 KB Flash 程序存储,512 Byte RAM。
  • I/O:多达 25 个通用数字 I/O 引脚,支持输入/输出复用。
  • ADC:10-bit A/D 转换器,适合传感器采集与模拟信号测量。
  • 时钟:内部振荡器,减少外部晶振器件,简化 BOM。
  • 电源与温度:工作电压范围 1.8 V ~ 3.6 V,工业级工作温度 -40 ℃ ~ +85 ℃。
  • 封装:28 引脚 SOIC(300 mil),便于通过波峰/回流焊装配与手工焊接。

三、电气与环境参数

该器件支持 1.8V 至 3.6V 宽电压工作区间,适配 1.8V 低压系统或常见 3.3V 供电平台。-40 ℃ 至 +85 ℃ 的温度等级满足工业级应用的可靠性要求。在电源与 I/O 设计上,应考虑适当的滤波和去耦以保证 ADC 等模拟模块的性能。

四、封装与引脚

封装为 28-SOIC(300 mil),在 PCB 布局时占板面积小、引脚间距适中,便于批量生产。根据引脚数量,可实现多路数字接口与模拟采样,并保留若干引脚用于外设扩展和编程调试。

五、典型应用

  • 便携式测量仪表与传感器节点:低功耗、内置 ADC 适合传感器信号采集。
  • 工业控制与嵌入式接口:工业级温度范围与丰富 I/O 满足现场控制需求。
  • 家用电器与消费类电子:成本敏感且需可靠性的控制单元。
  • 电池供电系统与能量采集设备:低压启动与低功耗睡眠模式利于延长续航。

六、设计要点与开发支持

  • PCB 布局建议在 VDD 附近放置 0.1 μF 去耦电容,靠近芯片供电引脚;若使用 ADC,增加模拟地和模拟供电的布局隔离。
  • 当工作在 1.8V 低电压时,外设电平兼容性需核对,必要时采用电平移位方案。
  • 内部振荡器可节省外部器件,但对时钟精度要求高的应用建议校准或使用外部晶振。
  • 开发工具:配套使用 Microchip 的 MPLAB X IDE、XC8 编译器,调试与编程可选 PICkit 或 ICD 系列编程器。参考官方数据手册获取寄存器与电气特性细节。

七、订购信息与替代

标准型号:PIC16LF1516-I/SO,品牌:Microchip(美国微芯),封装:28-SOIC。设计时可在 Microchip 官方网站或官方授权分销商处获取最新库存与订购代码。若需更高存储或更多外设,可参考 Microchip 同系列或相近系列其他型号作为替代或升级选项。

如需针对具体应用的引脚分配建议、参考电路或 PCB 布局示意,可提供应用场景与约束,我将给出针对性的优化建议。

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