WMSIC Electronic Components

MICROCHIP 24LC256-I/P 24LC256

Model24LC256-I/P
PackagePDIP-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP 24LC256-I / P
Type
MICROCHIP
Unit
Electronic Component
Minimum package
2400 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
24LC256-I/P
Electronic Component
1
Package
PDIP-8
Electronic Component
EEPROM
Electronic Component
0.877g
Electronic Component
1
Electronic Component
BM0258752545
Electronic Component
256Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
400kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:24LC256-I/P

概要

24LC256-I/P是由美国微芯(Microchip)公司推出的一款高性能EEPROM(电可擦可编程只读存储器),支持I²C通信接口,具有256Kb(32K x 8位)的存储容量,适用于多种嵌入式系统和数据存储应用。由于其非易失性的特性,24LC256-I/P能够在断电后保留数据,使其在需要持久存储的场合表现尤为优秀。

主要特性

  • 存储容量:24LC256-I/P提供256Kb的存储能力,这为用户提供了充裕的空间来存储所需的数据,如配置参数、校准数据、用户设置等。

  • 存储器类型:采用了非易失性EEPROM技术,确保数据在不通电的情况下能够持久保留,使其适用于汽车、消费电子和工业控制等领域。

  • 通信接口:该器件通过I²C接口与主机进行通信,支持多主模式,最高时钟频率可达400kHz,支持多达8个同一总线的设备连接,从而实现灵活的数据传输。

  • 写入和访问时间:在写入数据时,单字写入的最长写周期为5ms,访问时间则为900ns,满足大多数对存储读写速度有要求的应用场合。

  • 供电电压范围:24LC256-I/P的供电电压范围为2.5V到5.5V,能够兼容多种电源条件,适应各种工作环境。

  • 宽范围的工作温度:其工作温度范围为-40°C至85°C,保证在严苛环境下的可靠性和稳定性。

  • 安装类型及封装:该器件采用了通孔安装(Through-Hole Mounting)设计,封装类型为8-DIP(0.300",7.62mm),为PCB设计提供了便利,同时适合于各种手动或自动的组装工艺。

应用领域

24LC256-I/P广泛应用于工业、消费电子、医疗设备、汽车电子和其他需要数据存储记录的领域。具体应用包括但不限于:

  • 汽车电子:用于存储行车记录、仪表盘配置参数和故障诊断信息等。

  • 消费电子:在电视机、音响等设备中,存储用户的偏好设置和调整参数。

  • 工业控制:用于存储设备配置、传感器校准数据等关键的运行参数。

  • 医疗设备:用于存储病人监测数据和设备自检信息,确保数据的安全和持久性。

性能优势

24LC256-I/P借助其强大的存储能力和灵活的I²C接口,在电子设计中具备多项性能优势。其非易失性和广泛的工作温度范围为数据的可靠性提供了保障。超值的存写周期时间和访问速度则有效提升了整体系统的响应性。此外,通孔DIP封装的设计便于用户在实际应用中实现更好的集成。

总结

24LC256-I/P是一个功能强大的EEPROM解决方案,能在多种应用场景下提供可靠的存储性能。凭借其广泛的工作条件适应性和灵活的通信接口,成为许多设计工程师的首选元器件。如果您的项目需要一个稳定的、持久的数据存储方案,24LC256-I/P无疑是一个值得考虑的优秀选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.