Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MICROCHIP MCP73833T-AMI/UN MCP73833T
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MICROCHIP MCP73833T-AMI / UN
- Type
- MICROCHIP
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MICROCHIP
- Electronic Component
- MCP73833T-AMI/UN
- Electronic Component
- 1
- Package
- MSOP-10
- Electronic Component
- Battery Management
- Electronic Component
- 0.06g
- Electronic Component
- 1
- Features
- Programmable Current; Current; Battery
- Electronic Component
- BM0264780849
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 3.75V~6V
- Battery Type
- Battery
- Battery
- 1
- ICType
- IC
- 0VBattery
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：MCP73833T-AMI/UN
一、产品简介
MCP73833T-AMI/UN 是由美国微芯科技（Microchip Technology Inc.）推出的高性能锂离子和锂聚合物电池管理解决方案。该芯片以其精巧的MSOP-10表面贴装封装和全面的功能，让它成为便携式和小型电子设备中充电管理的理想选择。MCP73833T 提供了可编程恒流充电功能，最大充电电流可达1.1A，工作电压范围为4.2V，适合一块单电池结构的应用。
二、产品特性
- 电池组电压及结构：适用于单个锂离子或锂聚合物电池，电池组的工作电压为4.2V，符合锂电池的充电标准。
- 充电电流调节：MCP73833T 具备恒流充电模式，支持可编程充电电流，可根据实际应用需求进行灵活调整，最大充电电流为1.1A，确保快速且安全的充电过程。
- 广泛的工作温度范围：芯片的工作温度范围为-40°C到85°C，意味着其可以在极端环境下正常工作，适应多种应用需求。
- 故障保护功能：提供超温保护，确保设备在过热情况下能够自动停机，从而保护电池及电路的安全性。
- 总电源电压限制：该芯片支持最高6V的电压供电，可以与多种系统兼容，增强了设计的灵活性。
- 小尺寸封装：MSOP-10封装使其在空间受限的电子产品设计中尤为受欢迎，方便安装和更好的热管理。
三、应用场景
MCP73833T-AMI/UN 的设计使其可广泛应用于便携电子设备，例如：
- 智能手机和平板电脑：提供稳定的电池管理和充电功能。
- 可穿戴设备：因其小巧的体积，适合集成于运动手表、健康监测器等设备中。
- 消费类电子产品：如蓝牙耳机、行动电源等，提供高效的电池充电管理。
- 物联网设备：支持远程部署的可再充电电池组，适合智能家居、工业监控等应用。
四、设计与集成考虑
在设计集成 MCP73833T-AMI/UN 时，应考虑以下几点：
- 热管理：尽管芯片内置超温保护，但在高环境温度或高充电电流条件下，需合理配置散热措施。
- PCB布局：优化PCB设计，降低电流传输路径阻抗，避免电磁干扰，提高整体充电效率。
- 电源管理：确保供电电压稳定，以防止对充电过程的干扰，保障电池安全。
五、总结
MCP73833T-AMI/UN 是一款功能全面且高效的电池管理芯片，适合各种锂离子和锂聚合物电池的应用。它不仅提供可编程充电电流和多种内建保护机制，还能在宽温度范围内稳定工作。由于其小巧的封装和灵活的设计，MCP73833T-AMI/UN 预计将在未来的便携设备和物联网应用中发挥越来越重要的作用。无论是电池充电模块的设计工程师，还是电子产品开发者，MCP73833T都是一个优秀的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
