WMSIC Electronic Components

MICROCHIP PIC18F67K22-I/PT PIC18F67K22

ModelPIC18F67K22-I/PT
PackageTQFP-64(10x10)
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP PIC18F67K22-I / PT
Type
MICROCHIP
Minimum package
1600 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
PIC18F67K22-I/PT
Electronic Component
1
Package
TQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.094g
CPU
8 Bit
CPU
PIC
I / O
53
RAM
4KB
Electronic Component
1
ADC
12bit
EEPROM
1KB
Electronic Component
BM0257642530
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:PIC18F67K22-I/PT单片机

PIC18F67K22-I/PT是一款由美国微芯科技(Microchip Technology)研发的高性能8位单片机(MCU)。它采用现代先进的技术设计,旨在满足广泛的应用需求,尤其适合领域如物联网、工业控制、消费电子及汽车电子等。其多功能和高频率特点,使其成为各种嵌入式系统开发的重要选择。

核心处理器与性能

该芯片的核心处理器为PIC架构,具备强大的指令执行能力和高效的运行速度,能够在64MHz的主频下进行高速数据处理。针对复杂应用中的高效计算和实时控制,PIC18F67K22提供了丰富的外设集成和灵活的编程能力,以适应不同的设计需求。

存储与内存

PIC18F67K22-I/PT配备了128KB(64K x 16)的闪存程序存储器,支持多种代码存储和执行策略,适合用于复杂的代码结构和大型应用程序。此外,它还拥有1KB的EEPROM和4KB的RAM,可有效存储程序运行时的变量和临时数据。此外,芯片的内存和存储方案支持灵活的数据管理,使得开发者能够更轻松地开发应用。

外设功能

PIC18F67K22-I/PT内置丰富的外设功能。它支持多种通信协议,包括I²C、LINbus、SPI和UART/USART,使得该芯片在与其他设备或传感器的接入上具备极大的便利性和灵活性。此外,内建的欠压检测、复位、看门狗_timer(WDT)等功能,可提高系统的稳定性与可靠性。

模拟与数字转换

该单片机集成了16通道12位的A/D转换器,能够进行高精度的模拟信号采集,十分适合需要数据精密处理的应用场景。此特性使得该芯片能够处理来自环境传感器的信号,例如温度、压力和湿度传感器等,满足多种自动化和监控需求。

工作环境与供电

PIC18F67K22-I/PT具有广泛的供电电压范围,支持1.8V至5.5V的供电电压,适应不同的电源系统设计。其工作温度范围为-40°C至85°C,确保了在各种极端环境下的稳定运行,不论是在寒冷的工业环境还是高温的汽车内部,均可保持高效工作。

封装与安装

该产品采用64-TQFP(10x10毫米)的表面贴装型封装,具备较小的占板空间,适合高密度的电路板设计,符合现代电子产品小型化的发展趋势。这种封装类型很容易与自动化贴片技术兼容,为大批量生产提供便利。

应用领域

基于其强大的处理能力和丰富的外围接口能力,PIC18F67K22-I/PT适用的领域非常广泛,包括但不限于:

  • 工业自动化控制
  • 智能家居与物联网设备
  • 个人电子设备
  • 汽车电子系统
  • 医疗仪器和设备
  • 机器人控制系统

总结

总的来说,PIC18F67K22-I/PT是一款具有高性能、高集成度和高度灵活性的8位单片机,能够满足现代嵌入式应用中对处理速度、存储容量和外设接口的多样需求。其耐用的设计和广泛的应用场景使得该芯片在工程师和开发者中受到广泛的青睐,无论是进行小型原型设计还是进行大规模生产,都是一种理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.