WMSIC Electronic Components

MICROCHIP MIC4428YM-TR MIC4428YM

ModelMIC4428YM-TR
PackageSOIC-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MIC4428YM-TR
Type
MICROCHIP
Minimum package
2500 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MIC4428YM-TR
Electronic Component
1
Package
SOIC-8
Electronic Component
Gate Driver IC
Electronic Component
0.128g
Electronic Component
1
Electronic Component
BM0259722680
Operating Temperature
40℃~+150℃
Operating Voltage
4.5V~18V
Load Type
MOSFET
Driver
Electronic Component
Current(IOH)
1.5A
Current(IOL)
1.5A
Driver Channel Count
2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MIC4428YM-TR 产品概述

MIC4428YM-TR 是美国微芯(Microchip)推出的一款双通道低端(low-side)MOSFET栅极驱动器 IC,采用 8 引脚 SOIC 封装。器件为一通道反相、一通道非反相输出配置,专为驱动功率 N 沟 MOSFET 设计,适用于开关电源、电机驱动及功率管理等场合。

一、主要参数

  • 驱动配置:低边(Low-side)
  • 输出通道数:2(双通道)
  • 输入/输出极性:一路反相、一路非反相
  • 驱动能力:灌电流 IOL = 1.5 A,拉电流 IOH = 1.5 A(峰值能力,实际取决于工作条件)
  • 工作电压:VDD = 4.5 V ~ 18 V
  • 开关速度:上升时间 tr ≈ 18 ns,下降时间 tf ≈ 20 ns(典型)
  • 工作温度范围:-40 ℃ ~ +150 ℃(结温 Tj)
  • 封装:SOIC-8
  • 品牌:MICROCHIP(美国微芯)

二、功能与优势

  • 高驱动电流:1.5 A 的拉/灌能力能够快速对 MOSFET 门极充放电,减少开关损耗与过渡区热量。
  • 宽工作电压:4.5~18 V 的供电范围兼容常见功率电路供电轨,可直接驱动多数逻辑级与标准电平 MOSFET。
  • 反相/非反相组合:一反一正的输出配置,提供逻辑灵活性,便于在单片器件内实现互补控制或对称驱动策略。
  • 快速开关性能:18 ns / 20 ns 的典型上、下降时间,有利于高频 PWM 应用提升效率与响应速度。
  • 宽温度范围与工业级可靠性:高达 +150 ℃ 的结温规格适用严苛环境。

三、典型应用场景

  • DC-DC 降压/升压转换器的低端开关驱动
  • 无刷直流电机(BLDC)驱动低端晶体管
  • 同步整流器驱动与功率因数校正(PFC)电路
  • 开关电源、逆变器及常见功率开关模块的栅极驱动

四、设计与布局建议

  • 电源去耦:VDD 端应在芯片引脚附近放置 0.1 μF 陶瓷去耦,并配合 1 μF~10 μF 的旁路电容,降低瞬态压降。
  • 布线与接地:驱动输出至 MOSFET 门极的走线尽量短且粗,驱动器地(GND)与功率地应共地并采用短回流路径,避免环路面积过大以减少 EMI。
  • 门极电阻:根据 MOSFET 门电荷(Qg)与系统开关速度要求,建议在栅极串联 5 Ω~50 Ω 的阻尼电阻,以控制 dV/dt、抑制振铃并限制瞬时电流。
  • 热管理:虽然为 SOIC-8 封装,但高速切换时会产生功耗,应在 PCB 布局中为驱动器提供良好散热路径(底层铜皮、散热过孔)。
  • 系统匹配:在选择 MOSFET 时需注意其 Qg 与开关损耗,与驱动器的峰值电流与上/下降时间匹配,避免因驱动器能力不足或 MOSFET 容值过大引起过热或缓慢切换。

五、可靠性与测试要点

  • 在高温或高频工作条件下,关注结温(Tj)与功耗,必要时测算驱动器平均与瞬态能耗。
  • 做过压、欠压以及短路保护验证(若系统需),并考虑在输入端增加 RC 滤波或保护二极管以抑制干扰。
  • 建议在最终产品中做 EMI 测试与热测,确认在目标负载与频率下运行稳定。

六、小结

MIC4428YM-TR 是一款面向低端 MOSFET 驱动的高性能双通道栅极驱动器,具备 1.5 A 的拉/灌能力、宽电源电压与快速开关速度,适用于各类开关电源与功率转换场合。合理的 PCB 布局、去耦与门极阻尼设计将有助于发挥其性能并提升系统可靠性。若需详细管脚定义、典型电路与完整电气特性,请参考 Microchip 官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.