WMSIC Electronic Components

MICROCHIP ATMEGA162-16AU ATMEGA162

ModelATMEGA162-16AU
PackageTQFP-44(10x10)
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP ATMEGA162-16AU
Type
MICROCHIP
Minimum package
160 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
ATMEGA162-16AU
Electronic Component
1
Package
TQFP-44(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.499g
CPU
8 Bit
CPU
AVR
I / O
35
RAM
1KB
Electronic Component
1
EEPROM
512Byte
Features
(BOR / LVD / LVR / LVI); positions(POR); Gate positions; Built-in General Purpose; Programmable Gate
Electronic Component
BM0220667949
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ATMEGA162-16AU 产品概述

概述

ATMEGA162-16AU是Microchip(美国微芯)公司推出的一款高性能8位单片微控制器,具备丰富的外设功能和灵活的接口选项,广泛应用于嵌入式系统、自动化设备、工业控制、消费电子等领域。其小巧的44-TQFP封装(10mm x 10mm)使其非常适合空间较为紧凑的电子设备。

核心参数

ATMEGA162-16AU采用AVR架构,内部时钟速度可达16MHz,支持多种工作模式。该器件具有512字节的EEPROM存储,适合于存储配置参数及小型数据,此外,还拥有16KB的闪存用于程序存储,满足多样化的编程需求。用户可轻松使用C语言或汇编语言进行编程,提升开发效率。

电气特性

当工作在-40°C到85°C的温度范围内时,ATMEGA162-16AU的电源电压范围很宽,支持2.7V至5.5V的供电。这使得它在低功耗应用中非常灵活,适用于各种电源环境。器件内置的欠压检测(POR)电路,可在电源电压低于设定值时自动复位系统,保障系统安全稳定运行。

外设功能

ATMEGA162-16AU集成了多种外设功能,使其在面对不同应用时具备极大的灵活性:

  • 欠压检测与复位(POR): 该功能确保微控制器在电源电压降低时自动复位,保护数据安全及系统稳定。
  • 看门狗定时器(WDT): 用于监测软件运行状态,可在发生故障时自动重启微控制器,确保系统的可靠性。
  • 脉宽调制(PWM): 适用于电机控制、LED调光等多种应用。

此外,ATMEGA162-16AU还支持多种连接能力,包括:

  • SPI接口: 支持高速的数据通信,适合连接外部传感器和设备。
  • UART/USART接口: 适用于串口通信,方便与其他芯片或设备进行数据交互。
  • EBI/EMI: 可扩展外部存储器接口,提升系统存储能力。

存储特性

ATMEGA162-16AU配备1KB的SRAM用于数据存储,满足多数应用的需求,且512字节的EEPROM容量使得微控制器能够保存持久的用户数据和设置。闪存的16KB程序存储容量,能够容纳较为复杂的程序逻辑,为开发人员提供极大的自由度。

开发生态与支持

Microchip为ATMEGA162-16AU提供了丰富的开发工具和资源,包括统一的软件开发环境MPLAB X IDE,以及多款编程器和调试器。这些工具能够帮助开发者极大地简化产品开发流程,缩短产品上市时间。此外,Microchip的开发者社区也为工程师提供了良好的技术支持和解决方案交流平台。

应用场景

由于其性能、功能和灵活性,ATMEGA162-16AU广泛应用于各种领域,包括但不限于:

  • 消费电子: 智能家居、家用电器等。
  • 工业控制: 工厂自动化设备、过程控制系统。
  • 汽车电子: 车载信息娱乐系统、传感器数据处理。
  • 医疗设备: 便携式医疗监测设备、智能制药设备。

总结

综上所述,ATMEGA162-16AU凭借其强大的性能、丰富的外设以及灵活的应用能力,成为了各种嵌入式应用的理想选择。其典型的低功耗特性和高度的可靠性使其在日常生活和工业环境中都能表现出色,是现代嵌入式系统设计中不可或缺的一个核心部件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.