WMSIC Electronic Components

MICROCHIP MIC5209-3.3YS-TR MIC5209

ModelMIC5209-3.3YS-TR
PackageSOT-223
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MICROCHIP MIC5209-3.3YS-TR
Type
MICROCHIP
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
500mV@(500mA)
Electronic Component
MICROCHIP
Electronic Component
MIC5209-3.3YS-TR
Electronic Component
1
Package
SOT-223
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.25g
Electronic Component
1
Features
Voltage; Terminal Block
Electronic Component
BM0258754685
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
16V
Output
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MIC5209-3.3YS-TR 产品概述

产品简介

MIC5209-3.3YS-TR是一款高性能的线性稳压器(LDO),由美国微芯(Microchip Technology Inc.)公司生产。这款稳压器具备固定的输出电压,为3.3V,具有500mA的最大输出电流,适合多种电子设备的电源管理应用。

基本特性

  1. 输出特性:MIC5209-3.3YS-TR的输出类型为固定电压,输出电压为3.3V,能够为微处理器、传感器和其他逻辑电路提供可靠的电源。其最大输出电流为500mA,满足大多数中小功率设备的需求。

  2. 输入电压范围:该LDO的最大输入电压为16V,提供了广泛的输入电压兼容性,适用于不同的电源电压环境。这使得MIC5209-3.3YS-TR能够在多种应用场合中发挥作用。

  3. 低压降(Vdrop):该器件在500mA的输出条件下,其最大压降仅为600mV,这意味着在输出3.3V时,输入电压只需大于3.9V即可正常工作。这一特性确保产品在电池供电的应用中具有高效的功耗管理。

  4. 功率抑制比(PSRR):MIC5209的PSRR高达75dB(在120Hz时测得),使其能够有效地抑制输入电源电压的纹波和噪声,以保证输出电压的稳定性。因此,它非常适合用于对电压要求严格的应用场合,如音频设备和传感器系统。

  5. 工作电源电流和静态电流:该器件的工作电源电流最大为25mA,静态电流只为170µA,这使其在待机模式下具有良好的能效,特别适合于便携式和电池供电的设备。

  6. 工作温度范围:MIC5209的工作温度范围为-40°C至125°C,确保产品能够在极端环境下可靠工作,使其适合于工业、汽车及其他高温应用场合。

  7. 保护功能:该稳压器提供了多重保护功能,包括过流保护、超温保护和反极性保护,这极大地增强了其在实际应用中的安全性和可靠性。

  8. 封装类型:MIC5209-3.3YS-TR采用表面贴装型封装,规格为SOT-223-3,适配于自动化焊接工艺,适合大批量生产的需求。

应用领域

MIC5209-3.3YS-TR广泛应用于以下领域:

  • 消费电子:为各类便携式设备(如智能手机、平板电脑、可穿戴设备等)提供稳定的电源。
  • 工业控制:用于传感器和监控设备,确保在恶劣环境下的电源稳定性。
  • 通信设备:为无线发射器和接收器提供稳压电源,以确保信号的清晰和稳定传输。
  • 汽车电子:为汽车中的电子控制单元(ECU)和其他模块提供可靠的电源管理解决方案。

结论

综上所述,MIC5209-3.3YS-TR是一款功能强大且高度可靠的线性稳压器,适合各种电子应用。其固定的输出电压、良好的纹波抑制能力、宽泛的输入电压范围以及多种保护功能,使其成为了设计工程师在电源管理领域的重要选择。无论是在消费电子、工业设备还是汽车电子中,MIC5209-3.3YS-TR都能够提供优异的性能和稳定性,满足现代电子设备对电源管理的高要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.