Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC MMSS8050-H-TP MMSS8050
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MCC MMSS8050-H-TP
- Type
- MCC
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- MMSS8050-H-TP
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0000282493
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：MMSS8050-H-TP NPN 三极管
一、概述
MMSS8050-H-TP 是一款高性能 NPN 型晶体管，采用 SOT-23 封装，专为各种低功耗应用而设计。其主要特点包括1.5A 集电极电流能力、25V 的集射极峰值电压以及在广泛温度范围内的优异工作性能。这款晶体管在开关和放大电路中都表现出色，适用于多种电子设备和电路设计，如消费电子、汽车电子及工业控制等领域。
二、技术参数
- 类型: NPN
- 最大集电极电流 (Ic): 1.5A
- 最大集射极击穿电压 (Vce): 25V
- Vce 饱和压降: 在 80mA 到 800mA 的不同条件下，最大值为 500mV 和 800mV。此性能使其在开关应用中具有低能量损耗的优势。
- 集电极截止电流 (Ic(max)): 100nA，确保在关断状态时的低功耗。
- DC 电流增益 (hFE): 最小值为 120，在 100mA、1V 的条件下维持出色的增益特性。
- 最大功率: 625mW，适合多种功率需求的电路。
- 频率响应: 跃迁频率高达 100MHz，适合高速开关和高频应用。
- 工作温度范围: -55°C 至 150°C，适合严苛环境下的应用。
- 安装类型: 表面贴装型，适合现代电子产品的紧凑设计。
- 封装: TO-236-3, SC-59, SOT-23-3，常见的表面贴装封装，使其容易集成到各种电路板设计中。
三、应用场景
由于 MMSS8050-H-TP 晶体管的高性能特性，使其广泛适用于以下应用：
开关电路: 在数字电路和其他逻辑控制系统中，作为开关元件，能够有效控制设备的工作状态。
放大电路: 利用其高增益特性，能够放大微弱的信号，广泛应用于音频设备、传感器接口等领域。
消费电子: 包括电视、音响、游戏机等设备中的电源管理、信号处理和其他控制电路。
汽车电子: 应用于汽车控制系统，如电动窗、座椅调节及灯光控制等，要求在低功耗和高效能之间取得平衡。
工业控制: 适合用于PLC（可编程逻辑控制器）、运动控制及机器人系统中的驱动和开关应用。
四、优势
- 低饱和压降: 使其在开关应用中的效率显著提高，尤其在低电压操作中。
- 高工作温度范围: 自-55°C 到 150°C 的工作温度范围，增加了在极端环境下的可靠性，特别适合军事和航空航天领域。
- 小型封装: SOT-23 封装设计使其适合现代小型化电子设备的设计需求，节省PCB空间，同时便于大规模制造。
五、总结
MMSS8050-H-TP NPN 三极管以其高电流承载能力、优异的增益特性及广泛的工作温度范围，成为多种应用中的理想选择。无论您是在设计消费电子产品，还是寻求在高温或高频环境下的可靠元件，MMSS8050-H-TP 都能满足您的高性能需求。选择此晶体管，您将实现更高效、可靠和表现卓越的电子设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
