Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
一、产品背景 随着电子技术的不断发展,对高效能、低功耗的电子元件需求日益增长,肖特基二极管因其优良的性能被广泛应用于各种电子设备中。SM5817PL-TP是一款符合这一市场需求的高品质肖特基二极管,由美微科(MCC)生产,特别适用于高频开关电源、直流-直流转换器和各种负载驱动电路。
二、基本参数
安装类型:SM5817PL-TP为表面贴装型(SMD),这使得其在空间有限的电路板上更易于装配,并且具有良好的焊接性,适应现代电子生产的需要。
电容特性:产品在不同直流电压(Vr)和频率(F)条件下,其电容值为110pF @ 4V,1MHz,这一特性使其适合于高频应用,能够有效降低电路中的信号损失。
二极管类型:作为一款肖特基二极管,SM5817PL-TP具备快速恢复特性,其恢复时间不超过500ns,能够迅速响应信号的变化,减少开关损耗。
电流规格:该产品的平均整流电流(Io)能力为1A,充分满足大多数中低功率应用的需求。此外,当通过的正向电流(If)达到1A时,其正向电压(Vf)仅为450mV,展现了卓越的电能转换效率。这一低正向电压意味着在使用过程中产生的功率损耗极小,有效提升了电路的整体能效。
逆向电压:SM5817PL-TP的最大DC反向电压(Vr)为20V,适合于多种电源管理和保护电路,能够承受一定的反向电压波动,而不会轻易损坏。
反向泄漏电流:在20V的条件下,其反向泄漏电流仅为100µA,这低泄漏特性有助于降低待机能耗,并提高整体系统的效率。
工作温度:产品的工作结温范围为-65°C到125°C,这一宽广的温度范围使得其在各种工作环境中均能稳定运行,确保了产品的可靠性与耐用性。
三、封装与品牌 SM5817PL-TP采用SOD-123FL封装,这种封装形式具有小尺寸和轻量的特点,非常适合于需要高密度布线的现代电子产品中。MCC(美微科)作为生产品牌,凭借其丰厚的行业经验和技术积累,产品性能及质量得到了市场的广泛认可。
四、应用场景 SM5817PL-TP二极管广泛应用于多个领域,主要包括:
五、总结 SM5817PL-TP是一款设计先进的肖特基二极管,凭借其低正向电压、低反向泄露电流以及快速响应特性,成为广泛电子应用的理想选择。结合其优异的温度性能和小巧的SOD-123FL封装,使其在多种现代电子设备中得以普遍应用。MCC作为其生产厂家,确保了产品的高品质与可靠性,进一步推动了其在业内的广泛认可与应用。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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