WMSIC Electronic Components

MCC ESD3V3D9-TP ESD3V3D9

ModelESD3V3D9-TP
PackageSOD-923
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC ESD3V3D9-TP
Type
MCC
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
ESD3V3D9-TP
Electronic Component
1
Package
SOD-923
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.011g
Electronic Component
1
Cj- Capacitor
35pF
Electronic Component
BM0000001028
Operating Temperature
55℃~+150℃
Voltage
8.8V
Current(Ir)
5nA
Voltage(VBR)
5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:ESD3V3D9-TP

一、产品简介

ESD3V3D9-TP 是由美微科(MCC)制造的一款高性能静电放电(ESD)保护二极管,专为表面贴装技术设计。其封装形式为小型的 SOD-923,极大地节省了空间并能满足高密度电路板的需求。该器件可以有效保护敏感电子元器件,防止静电放电带来的损害。

二、主要特点

  1. 电压特性:

    • 反向断态电压:3.3V(典型值) - 适用于低电压系统;
    • 击穿电压最小值:5V - 确保在超出正常工作电压范围时能够快速响应。
  2. 瞬态性能:

    • 峰值脉冲电流:5A(10/1000µs) - 可以承受短时间内的高电流冲击,确保了在出现过电流情况时设备的安全。
    • 最大箝位电压:8.8V - 保障了在脉冲电压条件下的安全工作范围。
  3. 频率特性:

    • 不同频率下的电容:35pF @ 1MHz - 提供了良好的高频响应特性,适合高速信号应用。
  4. 环境适应性:

    • 工作温度范围:-55°C ~ 150°C(TJ) - 确保在极端环境条件下可靠运行,可以广泛应用于工业、汽车、消费电子等领域。

三、应用领域

ESD3V3D9-TP 适用于多种电子产品,尤其是在需要高可靠性和高耐压保护的场景中,包括但不限于:

  • 消费电子:手机、平板电脑和其他便携设备,确保其内部电路在遭受静电等外界干扰时安全可靠;
  • 通信设备:在高速数据传输设备(如路由器、交换机等)中,防止静电或电涌造成的故障或损坏;
  • 工业控制系统:保护可编程逻辑控制器(PLC)和其他敏感工业设备;
  • 汽车电子:应用于汽车电子控制单元(ECU)和内部通信网络,防止静电放电导致的故障。

四、设计优势

  1. 小型化设计: ESD3V3D9-TP 的 SOD-923 封装实现了小型化,方便在空间受限的设计中使用。

  2. 高可靠性: 该产品在严格的测试环境下经过验证,确保符合各类行业标准和要求,为设计师提供了良好的灵活性。

  3. 通用性强: ESD3V3D9-TP 是一款通用型静电保护二极管,适用于多种电路架构,能够简化设计过程并减少线下交付时间。

五、总结

ESD3V3D9-TP 作为一款功能强大且可靠的静电放电保护元器件,为现代电子设备提供了极高的保护性能。其出色的电气性能和环境适应性,使其能够在各种复杂的电气环境中稳定工作。通过选用 ESD3V3D9-TP,设计工程师能够有效降低设备在使用中的故障风险,提高产品的整体可靠性和耐用性。对于追求高品质和高可靠性的电子项目而言,ESD3V3D9-TP 是一个理想的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.