Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SK56L-TP 是一款由美微科(MCC)制造的高性能肖特基二极管,广泛应用于各种电子设备和电路设计。该二极管采用DO-214AB(SMC)封装,具有较高的电流和电压处理能力,非常适合于需要快速切换和高效率整流的应用场景。
封装/外壳:SK56L-TP的封装规格为DO-214AB(SMC),该封装形式适用于表面贴装(SMT)技术,便于在现代电子设备中实现小型化和高密度布局。
反向耐压 (VR):该二极管提供的最大反向耐压为60V,能够承受较高的反向电压,适用于多种电源管理电路及应用场景。
平均整流电流 (IF):SK56L-TP可以承受高达5A的平均整流电流,满足了对大电流需求的应用,如开关电源、充电器和电机驱动器等。
正向压降 (VF):在5A的工作条件下,该二极管的正向压降为750mV,低压降特点有助于提高整体能效,降低发热量,进而延长器件及周边电路的使用寿命。
反向漏电流 (IR):在60V的反向条件下,反向漏电流为1mA,表现出优秀的反向密封性能,减少无用功耗。
速度:作为一种快速恢复二极管,SK56L-TP在大于200mA的逆向电流下,其恢复速度优于500ns,适合高频开关应用。
工作温度范围:该器件能够在-55°C至150°C的广泛温度范围内工作,确保在严苛环境下的可靠性。
湿气敏感性等级(MSL):SK56L-TP的MSL等级为1,表示该二极管具有无限的耐湿能力,无需在操作时进行特别的干燥处理,方便大规模生产和应用。
由于其卓越的性能,SK56L-TP可广泛应用于多个领域:
SK56L-TP作为一款肖特基二极管,具有低正向压降和高整流电流的特点,相较于普通二极管,它能够显著减少电能损失,与此同时,由于较快的恢复时间,可以提升电路的工作效率和稳定性。此外,SK56L-TP在温度范围和湿气敏感度上的优异表现,使其在多种复杂环境下依旧能够稳定工作,展现出良好的持久性和可靠性。
SK56L-TP是电子工程师在设计高效、可靠的电源管理系统时的理想选择。其兼具高性能与高可靠性,适合于现代电子设备的多种应用场景。在当今对电子元器件高标准的需求背景下,SK56L-TP无疑是一个不可或缺的优秀方案。无论在电源设计、充电系统还是其他高效整流需求的应用中,SK56L-TP都将提供卓越的性能和信赖的保障。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products