Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2N7002-TP是一款高性能的N通道MOSFET,主要用于各种电子应用中,如开关电源、信号放大、功率控制和小型负载驱动等。该元件的设计目标是实现高效能和小型化,特别适合表面贴装(SMD)应用。其一致的电气性能和宽广的工作温度范围,使其成为众多电子设备中不可或缺的组件。
安装类型:2N7002-TP采用表面贴装型(SMT)封装,符合现代电子设备对空间和集成度的要求,使其能够在紧凑的板级设计中轻松安装和焊接。
额定电流和电压:
导通电阻(Rds(on)):在10V的Vgs条件下,器件在500mA的电流下导通电阻最大值为7.5Ω,表明在导通状态下器件表现出较低的能耗和较高的效率。
阈值电压(Vgs(th)):在250µA的条件下,阈值电压的最大值为2.5V,方便设计师在低电压驱动下直接控制MOSFET的开关状态。
输入电容(Ciss):在25V的偏置下,输入电容在最大值为50pF,这一相对较低的电容值有助于提升开关速度,降低开关损耗。
功率耗散:最大功率耗散为200mW,确保在实际应用中元件的温升保持在安全范围内。
工作温度:该产品的工作温度范围为-55°C至150°C,使其能够在严苛环境中运行,如汽车电子、工业控制等。
2N7002-TP采用流行的SOT-23封装,该封装形式不仅占用空间小,而且易于自动化焊接。SOT-23的外形和引脚配置使其适用于多种PCB设计,极大地方便了设计工程师在开发阶段的应用。
由于其优秀的电气特性和紧凑的尺寸,2N7002-TP在多个领域具有广泛的应用:
2N7002-TP是一款高效能、广泛适用的N通道MOSFET,具有合适的电压和电流处理能力,低导通电阻和优秀的热稳定性。其独特的设计适合于现代电子产品的需求,无论是在消费电子、工业控制还是汽车电子应用中,都能提供可靠的性能保障。由于其良好的品质和可靠性,2N7002-TP可被视为设计工程师在选择MOSFET时的优质选项。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products