Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC BAS40-TP BAS40
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC BAS40-TP
- Type
- SOT-23
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- BAS40-TP
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0219485335
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 10nA@30V
- (Vf)
- 380mV@1mA
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS40-TP 产品概述
产品简介
BAS40-TP 是一种高性能的肖特基二极管，广泛应用于各类电子设备中，特别适用于需要快速开关和低正向压降特性的应用场景。其主要电气特性使其非常适合于整流、保护电路以及高速开关电路等领域。
基本规格
电压和电流特性： BAS40-TP的最大反向电压（Vr）可达40V，能够有效应对大多数常见的电子应用。它的平均整流电流（Io）为200mA（DC），确保在大多数工作条件下具有稳定的工作性能。正向电压（Vf）在40mA时为1V，表明该二极管在正常工作条件下能够有效降低电能损耗，提高线路的整体效率。
反向恢复时间： BAS40-TP 的反向恢复时间（trr）为5ns，这一快速的反向恢复特性是其与传统二极管相比的显著优点，特别适用于高频开关应用，比如开关电源和逆变器等。
漏电流特性： 在30V的直流反向电压下，反向泄漏电流低至200nA，这意味着在电路处于关闭状态时对电流的浪费非常小，适合用于需要高效率的电源管理应用。
工作温度范围： 该元器件的结温范围在-55°C 到 125°C之间，能够在极端环境下正常工作，为用户提供了更多的设计灵活性。
封装与安装
BAS40-TP采用表面贴装型（SMD）封装，符合SOT-23标准。该封装设计有利于自动化生产线的装配，集成度高，适合于小型化的电子产品。其小巧的尺寸使得在狭小的PCB（印刷电路板）中也能够容易布局和焊接。
应用领域
开关电源： BAS40-TP的快速反向恢复和低正向压降特性非常适合用作开关电源中的整流二极管，提高整体能效。
电池管理： 在电池充电和放电过程中，BAS40-TP能够有效防止反向电流的流动，保护电池不受损坏。此外，低漏电流特性使得它在待机模式下耗电极低，延长电池使用寿命。
射频应用： 由于其高速特性，BAS40-TP也适用于射频（RF）应用中，帮助处理高频信号而不引入额外的相位延迟或功率损耗。
保护电路： BAS40-TP可以作为保护二极管使用，防止电路因过压而损坏。其快速反应时间保证了对电子设备的有效保护。
品牌与质量
BAS40-TP由MCC（美微科）制造，是该领域公认的高品质产品之一。美微科致力于提供高性能的电子元件，凭借先进的生产技术与严格的质量控制，确保每一颗元件的稳定性与可靠性。
总结
总之，BAS40-TP是一款极具吸引力的肖特基二极管，凭借其优越的电气性能、可靠的工作温度范围及其小型化的封装设计，成为现代电子产品中不可或缺的重要元件。无论是在高频应用还是在高效电源设计中，它都能够提供可靠的性能支持，是工程师设计实现各种电气解决方案的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
