WMSIC Electronic Components

MCC FM2000GP-TP FM2000GP

ModelFM2000GP-TP
PackageDO-214AC(SMA)
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC FM2000GP-TP
Type
MCC
Minimum package
7500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
FM2000GP-TP
Electronic Component
1
Package
DO-214AC(SMA)
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.36g
Electronic Component
1
Electronic Component
BM0230021951
Current
500mA
Current(Ir)
5uA@2kV
(Vf)
2.5V@500mA
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
7500
Voltage Rating(Vr)
2kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FM2000GP-TP 产品概述

一、产品简介

FM2000GP-TP 是 MCC(美微科)推出的一款高压、快恢复整流二极管,封装为 DO-214AC(SMA),面向高压整流与脉冲电源应用。器件在 500mA 工作电流条件下的典型正向压降为 2.5V,直流反向耐压达 2kV,反向漏电流仅为 5μA(@2kV),具有 500ns 的反向恢复时间 (Trr),同时支持 30A 的非重复峰值浪涌电流 (Ifsm)。工作结温范围宽 (-55℃ ~ +150℃),适应性强。

二、主要电气参数亮点

  • 正向压降 (Vf):2.5V @ IF = 500mA,能在中等电流下保持较低耗散,适合要求效率的高压整流场合。
  • 直流反向耐压 (Vr):2000V,适用于高压电源、倍压电路和高压偏置场景。
  • 反向电流 (Ir):5μA @ 2kV,低漏电有利于降低高压电源空载损耗与噪声。
  • 反向恢复时间 (Trr):500ns,属于快恢复类别,能在中等开关频率下减小开关损耗与振铃。
  • 平均整流电流:500mA,适合连续中等功率整流。
  • 非重复峰值浪涌电流 (Ifsm):30A,具备一定抗浪涌能力,应对上电或负载突变时的冲击。
  • 工作结温:-55℃ ~ +150℃,适应恶劣环境与长期工作需求。

三、封装与热性能

FM2000GP-TP 采用 DO-214AC(SMA)封装,具有良好的机械强度与标准化的焊接特性,便于自动化贴装与回流焊处理。SMA 封装的热阻相对较低,但在高平均功率条件下仍需通过 PCB 铜箔散热或底层散热片进行热管理。建议在设计时考虑合适的铜箔面积与热过孔,以降低结温并保证长期可靠性。

四、典型应用场景

  • 高压整流电源:用于 HV 电源、倍压器、偏置电源等,利用 2kV 的耐压与低漏电实现高压输出与稳定性。
  • 脉冲与探测类电路:适合中等频率脉冲整流与保护电路,500ns 的 Trr 能在脉冲恢复时减少能量回灌。
  • 医疗与检测设备:如高压偏置、PMT(光电倍增管)供电链路等,对高耐压与低漏电有要求的场合。
  • 工业高压驱动与测试设备:高压探头、静电控制与高压驱动模块的整流与保护。

五、设计与使用建议

  • 温度与漏电:反向漏电随结温上升显著增加,设计时应考虑在高温工况下的漏电容纳度,并留有余量。
  • 热量管理:若连续 500mA 工作时建议增加散热铜箔或热过孔,必要时将器件贴近散热体以降低结温。
  • 冲击保护:尽管 Ifsm 达 30A,但在实际电路中仍建议加入限流或软启动电路避免反复浪涌;对快速瞬态可采用 RC 或 RCD 吸收以抑制振铃。
  • PCB 布局:为降低寄生电感与减小开关应力,尽量缩短高压回路的走线,增加器件脚间和对地的爬电距离以满足安全规范。
  • 焊接与储存:遵循 SMA 封装的回流焊温度曲线与湿敏等级处理,避免在高温或潮湿环境下导致封装性能下降。

六、可靠性与质量保证

MCC(美微科)产品经过严格的工艺与测试流程,FM2000GP-TP 在高压耐压、漏电、反向恢复及冲击能力上均达到工业级要求。建议在关键应用中进行产品批次样机测试,验证在目标工作温度、频率与浪涌条件下的长期可靠性。对于特殊认证或更高应力需求,可与供应商沟通获取详细的可靠性数据与应用建议。

总结:FM2000GP-TP 以其 2kV 高耐压、低漏电与中等速率的快恢复特性,适合多类高压整流与偏置场景。在实际应用中注意热管理、漏电随温度上升的影响以及浪涌保护措施,可发挥其在高压、小体积设计中的优势。

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