Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM2000GP-TP 是 MCC(美微科)推出的一款高压、快恢复整流二极管,封装为 DO-214AC(SMA),面向高压整流与脉冲电源应用。器件在 500mA 工作电流条件下的典型正向压降为 2.5V,直流反向耐压达 2kV,反向漏电流仅为 5μA(@2kV),具有 500ns 的反向恢复时间 (Trr),同时支持 30A 的非重复峰值浪涌电流 (Ifsm)。工作结温范围宽 (-55℃ ~ +150℃),适应性强。
FM2000GP-TP 采用 DO-214AC(SMA)封装,具有良好的机械强度与标准化的焊接特性,便于自动化贴装与回流焊处理。SMA 封装的热阻相对较低,但在高平均功率条件下仍需通过 PCB 铜箔散热或底层散热片进行热管理。建议在设计时考虑合适的铜箔面积与热过孔,以降低结温并保证长期可靠性。
MCC(美微科)产品经过严格的工艺与测试流程,FM2000GP-TP 在高压耐压、漏电、反向恢复及冲击能力上均达到工业级要求。建议在关键应用中进行产品批次样机测试,验证在目标工作温度、频率与浪涌条件下的长期可靠性。对于特殊认证或更高应力需求,可与供应商沟通获取详细的可靠性数据与应用建议。
总结:FM2000GP-TP 以其 2kV 高耐压、低漏电与中等速率的快恢复特性,适合多类高压整流与偏置场景。在实际应用中注意热管理、漏电随温度上升的影响以及浪涌保护措施,可发挥其在高压、小体积设计中的优势。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products