Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C5V1-TP 是一款低漏电流、表面贴装的稳压二极管,采用 SOD-123 封装,主要用于稳压电路和过压保护应用。其典型稳压值为 5.1V,电流反向泄漏在 2V 下为 2μA,显示出优秀的性能和高可靠性,特别适合需要高精度稳压的电子产品。
稳压值:BZT52C5V1-TP 的典型稳压值(Vz)为 5.1V,工作电压范围在 4.8V 至 5.4V 之间,提供了稳定的电压输出。
反向漏电流:在 2V 的反向电压下,BZT52C5V1-TP 的漏电流为 2μA。这一极低的值使其在低功耗应用中表现出色,能够减少功率损耗并提高系统的整体效率。
最大功率:该器件的最大功率限制为 500mW,确保在设计电路时可以有效的控制功率消耗,避免过载。
功率 - 最大值:其在某些特定工作条件下的功率最大值为 200mW,适合在中等功率下的稳压需求。
阻抗:BZT52C5V1-TP 的最大阻抗(Zzt)为 60Ω,使其在高频响应中具有良好的稳定性和控制能力。
正向电压:在 10mA 的正向电流下,其正向电压为 900mV,该参数对于二极管的开关特性和电路设计也至关重要。
工作温度:适用的工作温度范围在 -65°C 至 150°C,使其能够在苛刻的环境条件下依然保持良好的稳定性和性能。
安装类型:表面贴装类型的设计,使其能够适用于现代电子设备的小型化需求,便于自动化焊接过程。
BZT52C5V1-TP 稳压二极管广泛应用于多个领域,主要包括:
电源管理:作为稳压元件,有效保障电源输出的稳定性,避免由于电压波动对后级电路造成影响。
过压保护:在电路遭受过电压冲击时,能够迅速反向导通,保护重要元件和电路免受损伤。
信号保护:在一些对于电压要求严格的信号处理电路中使用,可以确保信号的完整性和稳定性。
消费电子:在手机、平板电脑、笔记本电脑等消费电子产品中,作为抑制电压尖峰的保护元件,确保其正常工作。
该产品符合相关国际标准和规范,具有很高的可靠性及环境适应性,非常适合工业应用及高要求的电子产品。其设计和制造均遵循 IPC 标准,确保其在高温、高湿等环境中稳定工作。
BZT52C5V1-TP 稳压二极管凭借其极低的反向漏电流、适中的功率处理能力以及广泛的温度适应范围,成为了市场上高度推荐的稳压组件之一。其表面贴装的 SOD-123 封装设计满足了现代小型化和高性能电子设备的需求,是电源管理、过电压保护、电路稳定性的理想之选。美微科 (MCC) 的这一产品,经过严格的测试与验证,提供了一种可靠的解决方案,充分满足各类电子设备的需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products