WMSIC Electronic Components

MCC BZT52B56JS-TP BZT52B56JS

ModelBZT52B56JS-TP
PackageSOD-323
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MCC BZT52B56JS-TP
Type
MCC
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
BZT52B56JS-TP
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
±2%
Electronic Component
0.028g
Electronic Component
1
(Zzk)
1kΩ
(Zzt)
135Ω
Electronic Component
BM0258679163
Diode
1
Current(Ir)
100nA@42V
Power Dissipation(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52B56JS-TP 产品概述

一 产品简介

BZT52B56JS-TP 为美微科(MCC)生产的高压小功率稳压二极管,标称稳压值为 56V,最大耗散功率 200 mW,采用 SOD-323 小型表面贴装封装。该器件针对需要高压基准或低电流浪涌钳位的便携与板载应用,提供体积小、漏电低的稳压解决方案。

二 主要电气参数

  • 标称稳压:56V(Zener)
  • 最大耗散功率:200 mW(器件耗散限制)
  • 反向漏电流 Ir:100 nA @ 42V(典型测试点)
  • 封装:SOD-323(小型SMD)
    注:实际使用时应参考官方 datasheet 获取测试电流 Iz、稳压容差与温度系数等完整参数。

三 特性与优势

  • 极低的反向漏电流:在 42V 条件下 Ir 仅 100 nA,适合对静态电流敏感的高阻电路。
  • 小体积表面贴装:SOD-323 适合高密度 PCB 设计和自动化贴装。
  • 适用于高压稳压与钳位:56V 标称电压适合对高电压节点进行基准或过压保护(低能量冲击)。
  • 便于功率预算:根据 Pz = Vz · Iz,可估算最大稳压电流 Iz_max ≈ 0.2W / 56V ≈ 3.6 mA,须在设计中留有裕量并做好散热/降额处理。

四 典型应用场景

  • 高压偏置源与参考电压(低电流场合)
  • 小信号电路中过压钳位或保护(以限制能量为前提)
  • 测试与测量设备中的高压分压/基准补偿
  • 便携或板载电源中对辅助高压节点的稳压

五 封装与安装注意

SOD-323 为小型贴片封装,需注意焊盘设计与回流工艺以保证良好焊点和热阻。由于器件最大耗散仅 200 mW,焊盘和铜箔面积会影响热散逸,建议在需要连续稳压的大电流应用中采用更大功率器件或增加外部散热措施。

六 选型与使用建议

  • 若稳压点需长期工作且电流接近 Iz_max,应选用更高功率等级的稳压二极管或改为线性稳压器。
  • 使用时通常在前端加串联限流电阻以控制通过二极管的电流并吸收瞬态能量。
  • 在高温环境或需要严格精度时,参考数据表中的温度系数与稳压容差,必要时做温漂补偿。
  • 对于更高能量的浪涌保护,优先考虑瞬态抑制二极管(TVS)或功率更大的 Zener。

七 型号与采购

型号:BZT52B56JS-TP;品牌:MCC(美微科);封装:SOD-323。采购与替代时请核对封装、功率与稳压容差,必要时索取厂商 datasheet 与样片以便验证电气特性与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.