Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC ER3J-TP ER3J
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC ER3J-TP
- Type
- MCC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- ER3J-TP
- Electronic Component
- 1
- Package
- DO-214AB（SMC）
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.361g
- Electronic Component
- 1
- Electronic Component
- BM0227707033
- Current
- 3A
- Current(Ir)
- 5uA@600V
- (Vf)
- 1.7V@3A
- Electronic Component
- 50℃~+175℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 600V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ER3J-TP 产品概述
ER3J-TP 是美微科（MCC）推出的一款高耐压、表面贴装的标准整流二极管，采用 DO-214AB（SMC）封装，面向工业级电源与电力电子应用。器件在高温环境下仍保持稳定性能，适合对可靠性与耐热性要求较高的场合。
一、主要参数与电气特性
- 型号：ER3J-TP
- 品牌：MCC（美微科）
- 封装：DO-214AB（SMC），表面贴装
- 直流反向耐压 Vr：600 V
- 整流电流（平均）Io：3 A
- 正向压降 Vf：1.7 V @ 3 A
- 非重复峰值冲击电流 Ifsm：100 A
- 反向电流 Ir：5 μA @ 600 V
- 反向恢复时间 Trr：35 ns
- 工作结温范围 Tj：-50 ℃ ~ +175 ℃
以上参数表明 ER3J-TP 在高电压与高温条件下具备良好的耐受能力，且具备较高的冲击电流承受能力，适用于瞬态电流较大的应用场景。
二、主要特点与优势
- 高耐压：600V 额定反向电压，适配多数中高压整流或保护场合。
- 低漏电：在额定耐压下反向电流仅 5 μA，有利于降低损耗与系统静态功耗。
- 良好浪涌能力：100A 的 Ifsm 提供对启动浪涌或短时过载的保护能力。
- 宽工作温度：-50℃ 至 +175℃ 的结温范围满足汽车电子与工业级应用的严苛温度要求。
- 可靠封装：SMC 封装便于表面贴装工艺，适配自动化生产。
三、典型应用场景
- 开关电源（SMPS）整流与续流二极管
- 功率因数校正（PFC）与整流桥
- 工业电源、逆变器与电机驱动保护
- 充电器与适配器的高压整流
- 需要抗浪涌与耐高温的电源管理模块
四、使用建议与注意事项
- 在高频开关场合，35 ns 的反向恢复时间属快速恢复级别，但若系统要求极低开关损耗或超高频切换，建议评估是否使用肖特基（二极管）或同步整流方案。
- 建议在 PCB 上为 SMC 封装提供充足铜箔散热面积，必要时加大过孔和散热层以降低结温。
- 遵循制造商推荐的回流焊温度曲线进行贴装，避免超温或长时间高温导致封装或焊点失效。
- 虽具备 100A 峰值浪涌能力，仍需避免重复长时浪涌，按实际应用进行热与电应力评估与保护设计（保险丝、限流等）。
五、可靠性与采购建议
ER3J-TP 具备工业级温度范围和较强的浪涌承受能力，适合长期可靠运行的电源及保护电路。采购时建议向供应商确认批次出货检验报告（如电气参数、外观、熔点与封装完整性），并在设计验证阶段进行温升测试与过压/过流极限测试，确保在目标应用中满足寿命与可靠性要求。
如需针对具体电路（如 PFC、半桥续流、整流桥）进行参数匹配或热设计建议，可提供电路工作条件与环境参数，我可进一步给出优化方案。
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