Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC BZX84C12HE3-TP BZX84C12HE3
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC BZX84C12HE3-TP
- Type
- MCC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- BZX84C12HE3-TP
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Zener Diode
- Electronic Component
- ±5%
- Electronic Component
- 0.032g
- Electronic Component
- 1
- (Zzk)
- 150Ω
- (Zzt)
- 25Ω
- Electronic Component
- BM0264862574
- Diode
- 1
- Current(Ir)
- 100nA@8V
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- 11.4V~12.7V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZX84C12HE3-TP 产品概述
一、产品简介
BZX84C12HE3-TP 是美微科（MCC）推出的一款小功率稳压（Zener）二极管，单只独立式器件，封装为 SOT-23，标称稳压值 12V，精度 ±5%。器件定位为低功耗、体积小、适合贴片安装的基准稳压与钳位应用，常用于便携设备与空间受限的电源管理场景。
二、主要参数
- 品牌/型号：MCC / BZX84C12HE3-TP
- 稳压值（标称）：12V（范围 11.4V ~ 12.7V）
- 反向电流 Ir：100nA @ 8V
- 最大耗散功率 Pd：350mW（环境温度及散热条件相关）
- 动态阻抗 Zzt：25Ω
- 脉冲/拐点阻抗 Zzk：150Ω
- 工作结温范围：-55℃ ~ +150℃
- 精度：±5%
- 封装：SOT-23（贴片）
三、特性与优点
- 小型 SOT-23 封装，适合高密度 PCB 布局。
- 低反向漏电流，适合微小电流测量与精密基准场合。
- 350mW 的耗散能力适用于小功率稳压和钳位保护。
- 动态阻抗较低（Zzt=25Ω），在工作电流范围内稳压性能稳定。
- 宽温度范围（-55℃～+150℃），适应工业级环境。
四、典型应用
- 小功率基准电压源与参考电路。
- 低电流稳压与偏置电路。
- 过压钳位与电平保护。
- 通信与计量模块中的电压截断。
- 便携式设备、仪表与传感前端的稳压需求。
五、封装与布局建议
BZX84C12HE3-TP 为 SOT-23 贴片件，适合自动贴装。实际引脚定义请以厂商封装资料为准。PCB 布局建议：靠近需稳压的节点布置，尽量保证良好散热路径；在高温或接近 Pd 极限的应用中，增加铜箔面积或使用散热填充以降低结温。对于长期可靠性，建议在实际工作点将耗散控制在额定 Pd 的 50%~70% 范围内，并考虑随结温线性降额。
六、可靠性与注意事项
- 器件耐静电，搬运与贴装过程请遵循 ESD 防护规范。
- 在瞬态过压或大电流条件下，避免超过 Zzk 指定的极限，必要时与限流电阻或保护电路配合使用。
- 选型与设计时，请参考 MCC 的完整数据手册以获得详细特性曲线、最大额定值与封装尺寸信息。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
