WMSIC Electronic Components

MCC 1N5819- 1N5819

Model1N5819-AP
PackageDO-41
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC 1N5819-AP
Type
MCC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
1N5819-AP
Electronic Component
1
Package
DO-41
Electronic Component
Schottky Diode
Electronic Component
0.296g
Electronic Component
1
Electronic Component
BM0226046108
Current
1A
Diode
1
Current(Ir)
100uA@40V
(Vf)
600mV@1A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N5819-AP 产品概述

一、产品简介

1N5819-AP 为 MCC(美微科)出品的通孔肖特基整流二极管,额定直流正向电流为 1A,直流反向耐压 40V。该器件采用 DO-41 轴向封装,适合传统插装与手工焊接工艺,常用于低压快速整流与反向保护场合。

二、主要特性

  • 直流整流电流:1A(连续)
  • 直流反向耐压(Vr):40V
  • 正向压降(Vf):600mV @ 1A(典型应用条件下)
  • 非重复峰值浪涌电流(Ifsm):30A(浪涌、不重复)
  • 反向电流(Ir):100μA @ 40V
  • 工作结温范围:-55℃ ~ +125℃
  • 封装:DO-41,通孔轴向,带极性带标识(阴极有环带)

三、电气参数要点

1N5819-AP 属肖特基结结构,具有较低的正向压降与快速恢复特性,但在高温或高反向电压下反向漏电流相对较大(规格为 100μA @ 40V)。在要求低损耗与高开关频率的低压电源和保护电路中表现良好。非重复峰值浪涌 30A 能够承受短时突发负载或浪涌电流。

四、封装与机械特性

DO-41 轴向封装便于通孔安装与手工焊接,导线长度与直径适配常规电路板。器件在安装时应注意极性方向(阴极环带)。尽量避免在高温下长时间焊接,以免影响器件寿命和参数稳定性。

五、典型应用场景

  • 开关电源输出整流(低压区)
  • 反向极性保护、电源防回流
  • 续流二极管(freewheeling)与钳位电路
  • 电池充放电路径、汽车电子低压电路(需注意温度下的反向漏电)
  • 通用低压功率整流场合

六、使用与注意事项

  • 在高温环境下反向漏电(Ir)会增大,设计时需留有安全余量或选用散热措施。
  • 连续工作电流 1A 时应关注封装散热与环境温度,必要时加装散热元件或减小占空比。
  • 浪涌电流虽然可达 30A,但仅限短时非重复冲击;频繁浪涌会损害器件。
  • 焊接建议遵循通孔焊接工艺规范,避免长时间高温暴露及机械应力。

七、包装与订购信息

型号:1N5819-AP;品牌:MCC(美微科);封装:DO-41(轴向通孔)。订购时请确认批次与出厂检验报告以满足特定应用对漏电流与正向压降的控制要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.